Tsung-Te Yuan

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an interposer
- Patent number 9,515,048
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Wen-Kuang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170148761
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN INTERPOSER
- Publication number 20160020190
- Publication date Jan 21, 2016
- Siliconware Precision Industries Co., Ltd.
- Wen-Kuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035164
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035163
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS