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Tsung Wen Chang
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Kaohsiung, TW
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last 30 patents
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Patent Grant
Leadframe for integrated circuit die packaging in a molded package...
Patent number
8,956,920
Issue date
Feb 17, 2015
NXP B.V.
Tsung Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LEADFRAME FOR INTEGRATED CIRCUIT DIE PACKAGING IN A MOLDED PACKAGE...
Publication number
20130319744
Publication date
Dec 5, 2013
NXP B.V.
Tsung Yi Wu
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Patent Application
MULTI-LINKAGE PRESS
Publication number
20130008325
Publication date
Jan 10, 2013
Yu-Ting LIN
B30 - PRESSES