Tsung Yao Chu

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wireless sensor network and sampling rate allocation method thereof
- Patent number 8,085,134
- Issue date Dec 27, 2011
- Industrial Technology Research Institute
- Tsung-Hsien Chu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonding pad and method for manufacturing it
- Patent number 6,566,752
- Issue date May 20, 2003
- Industrial Technology Research Institute
- Chin Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an aperture position through a substrat...
- Patent number 6,459,150
- Issue date Oct 1, 2002
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package incorporating dual stress buffer layers for I/O...
- Patent number 6,433,427
- Issue date Aug 13, 2002
- Industrial Technology Research Institute
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad and method for manufacturing it
- Patent number 6,426,555
- Issue date Jul 30, 2002
- Industrial Technology Research Institute
- Chin Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated process for I/O redistribution and passive components fa...
- Patent number 6,365,498
- Issue date Apr 2, 2002
- Industrial Technology Research Institute
- Tsung-Yao Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bumping/bonding process utilizing edge-type conductive...
- Patent number 6,312,974
- Issue date Nov 6, 2001
- Industrial Technology Research Institute
- En-Boa Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging method and devices formed
- Patent number 6,197,613
- Issue date Mar 6, 2001
- Industrial Technology Research Institute
- Ling-Chen Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low cost integrated resistor capacitor combi...
- Patent number 5,893,731
- Issue date Apr 13, 1999
- Industrial Technology Research Institute
- Chang-Shu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRELESS SENSOR NETWORK AND SAMPLING RATE ALLOCATION METHOD THEREOF
- Publication number 20090251297
- Publication date Oct 8, 2009
- Industrial Technology Research Institute
- Tsung-Hsien Chu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Bonding pad and method for manufacturing it
- Publication number 20020149115
- Publication date Oct 17, 2002
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chin Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE INCORPORATING DUAL STRESS BUFFER LAYERS FOR I/O...
- Publication number 20020093107
- Publication date Jul 18, 2002
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Enboa Wu
- H01 - BASIC ELECTRIC ELEMENTS

Tsung Yao Chu

Person

Patents Grantslast 30 patents

Wireless sensor network and sampling rate allocation method thereof

Bonding pad and method for manufacturing it

Electronic substrate having an aperture position through a substrat...

Wafer level package incorporating dual stress buffer layers for I/O...

Bonding pad and method for manufacturing it

Integrated process for I/O redistribution and passive components fa...

Simultaneous bumping/bonding process utilizing edge-type conductive...

Wafer level packaging method and devices formed

Method for fabricating low cost integrated resistor capacitor combi...

Patents Applicationslast 30 patents

WIRELESS SENSOR NETWORK AND SAMPLING RATE ALLOCATION METHOD THEREOF

Bonding pad and method for manufacturing it

WAFER LEVEL PACKAGE INCORPORATING DUAL STRESS BUFFER LAYERS FOR I/O...