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Tsung-Yen Tseng

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  • Ping-Tung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Formation method for conductive bump
    • Patent number 7,041,590
    • Issue date May 9, 2006
    • Advanced Semiconductor Engineering Inc.
    • Tsung-Yen Tseng
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents