Tsutomu Asai

Person

Nerima-ku, Tokyo 177, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin-coated copper foil, and printed wiring board using resin-coat...
- Patent number 6,831,129
- Issue date Dec 14, 2004
- Mitsui Mining & Smelting Co. Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIR...
- Patent number 6,716,530
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-coated composite foil, production and use thereof
- Patent number 6,652,962
- Issue date Nov 25, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing vias in the manufacture of printed circuit boards
- Patent number 6,240,636
- Issue date Jun 5, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Tsutomu Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High tensile strength electrodeposited copper foil
- Patent number 6,194,056
- Issue date Feb 27, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composition for copper-clad laminate, resin-coated copper foi...
- Patent number 6,187,416
- Issue date Feb 13, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Tetsurou Satoh
- B32 - LAYERED PRODUCTS
Information Patent Grant
High tensile strength electrodeposited copper foil and process of e...
- Patent number 5,958,209
- Issue date Sep 28, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nutating step motor
- Patent number 5,309,041
- Issue date May 3, 1994
- Nihon Riken Kabushiki Kaisha
- Teruo Kawai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Resin-coated copper foil, and printed wiring board using resin-coat...
- Publication number 20030087101
- Publication date May 8, 2003
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin compound for fabricating interlayer dielectric of printed wir...
- Publication number 20020106516
- Publication date Aug 8, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tsutomu Asai

Person

Patents Grantslast 30 patents

Resin-coated copper foil, and printed wiring board using resin-coat...

RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIR...

Resin-coated composite foil, production and use thereof

Method for producing vias in the manufacture of printed circuit boards

High tensile strength electrodeposited copper foil

Resin composition for copper-clad laminate, resin-coated copper foi...

High tensile strength electrodeposited copper foil and process of e...

Nutating step motor

Patents Applicationslast 30 patents

Resin-coated copper foil, and printed wiring board using resin-coat...

Resin compound for fabricating interlayer dielectric of printed wir...