Tsutomu Mimata

Person

Akikawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die packing device
- Patent number 6,760,968
- Issue date Jul 13, 2004
- Kabushiki Kaisha Shinkawa
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conveyor apparatus for dies and small components
- Patent number 6,579,057
- Issue date Jun 17, 2003
- Kabushiki Kaisha Shinkawa
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die holding mechanism for a die with connecting wires thereon
- Patent number 6,505,397
- Issue date Jan 14, 2003
- Kabushiki Kaisha Shinkawa
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip bonding method and apparatus
- Patent number 6,383,844
- Issue date May 7, 2002
- Kabushiki Kaisha Shinkawa
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of aligning and bonding tab inner leads
- Patent number 5,059,559
- Issue date Oct 22, 1991
- Hitachi, Ltd.
- Michio Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus
- Patent number 5,015,425
- Issue date May 14, 1991
- Hitachi, Ltd.
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of bonding insulated and coated wire
- Patent number 4,950,866
- Issue date Aug 21, 1990
- Hitachi, Ltd.
- Toosaku Kojima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus
- Patent number 4,890,780
- Issue date Jan 2, 1990
- Hitachi, Ltd.
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method
- Patent number 4,763,827
- Issue date Aug 16, 1988
- Hitachi, Ltd.
- Kenji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus
- Patent number 4,674,670
- Issue date Jun 23, 1987
- Hitachi, Ltd.
- Kenji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 4,405,242
- Issue date Sep 20, 1983
- Hitachi, Ltd.
- Hideki Kosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 4,348,751
- Issue date Sep 7, 1982
- Hitachi, Ltd.
- Hideki Kosaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die pickup method and die pickup apparatus
- Publication number 20020129899
- Publication date Sep 19, 2002
- KABUSHIKI KAISHA SHINKAWA
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for processing semiconductor pellets
- Publication number 20020062916
- Publication date May 30, 2002
- KABUSHIKI KAISHA SHINKAWA
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die packing device and die bonding apparatus
- Publication number 20020046460
- Publication date Apr 25, 2002
- KABUSHIKI KAISHA SHINAWA
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor devices
- Publication number 20020037631
- Publication date Mar 28, 2002
- KABUSHIKI KAISHA SHINKAWA
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conveyor apparatus for dies and small components
- Publication number 20010051092
- Publication date Dec 13, 2001
- KABUSHIKI KAISHA SHINKAWA
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip bonding method and apparatus
- Publication number 20010005602
- Publication date Jun 28, 2001
- KABUSHIKI KAISHA SHINKAWA
- Tsutomu Mimata
- H01 - BASIC ELECTRIC ELEMENTS

Tsutomu Mimata

Person

Patents Grantslast 30 patents

Die packing device

Conveyor apparatus for dies and small components

Die holding mechanism for a die with connecting wires thereon

Multi-chip bonding method and apparatus

Method of aligning and bonding tab inner leads

Manufacturing apparatus

Method and apparatus of bonding insulated and coated wire

Manufacturing apparatus

Manufacturing method

Manufacturing apparatus

Electronic device and method of fabricating the same

Electronic device and method of fabricating the same

Patents Applicationslast 30 patents

Die pickup method and die pickup apparatus

Method and apparatus for processing semiconductor pellets

Die packing device and die bonding apparatus

Method for manufacturing semiconductor devices

Conveyor apparatus for dies and small components

Multi-chip bonding method and apparatus