Tsutomu Nakazawa

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin-molded type semiconductor device and method of manufacturing...
- Patent number 5,757,066
- Issue date May 26, 1998
- Kabushiki Kaisha Toshiba
- Yumi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,733,802
- Issue date Mar 31, 1998
- Kabushiki Kaisha Toshiba
- Yumi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for use in a resin-sealed type semiconductor device
- Patent number 5,684,327
- Issue date Nov 4, 1997
- Kabushiki Kaisha Toshiba
- Tsutomu Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device and lead frame used in a resin-se...
- Patent number 5,648,682
- Issue date Jul 15, 1997
- Kabushiki Kaisha Toshiba
- Tsutomu Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a region doped to a level exceeding the...
- Patent number 5,518,937
- Issue date May 21, 1996
- Fujitsu Limited
- Yuji Furumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device of multichip module-type
- Patent number 5,401,688
- Issue date Mar 28, 1995
- Kabushiki Kaisha Toshiba
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a region dope...
- Patent number 5,270,224
- Issue date Dec 14, 1993
- Fujitsu Limited
- Yuji Furumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having resin encapsulated tab tape connections
- Patent number 5,248,895
- Issue date Sep 28, 1993
- Kabushiki Kaisha Toshiba
- Tsutomu Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device having a particular mold resin st...
- Patent number 5,191,403
- Issue date Mar 2, 1993
- Kabushiki Kaisha Toshiba
- Tsutomu Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a region doped to a level exceeding the...
- Patent number 5,111,266
- Issue date May 5, 1992
- Fujitsu Limited
- Yuji Furumura
- H01 - BASIC ELECTRIC ELEMENTS

Tsutomu Nakazawa

Person

Patents Grantslast 30 patents

Resin-molded type semiconductor device and method of manufacturing...

Semiconductor device and method of manufacturing the same

Lead frame for use in a resin-sealed type semiconductor device

Resin-sealed semiconductor device and lead frame used in a resin-se...

Semiconductor device having a region doped to a level exceeding the...

Semiconductor device of multichip module-type

Method of manufacturing a semiconductor device having a region dope...

Semiconductor apparatus having resin encapsulated tab tape connections

Resin-sealed semiconductor device having a particular mold resin st...

Semiconductor device having a region doped to a level exceeding the...