Tsutomu Onoue

Person

Kariya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, method and apparatus for fabricating the same
- Patent number 7,405,107
- Issue date Jul 29, 2008
- Denso Corporation
- Shusaku Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device having a buffer element between the molding and the s...
- Patent number 7,404,321
- Issue date Jul 29, 2008
- Denso Corporation
- Masaaki Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Resin molded articles and method of manufacturing the same
- Patent number 6,926,940
- Issue date Aug 9, 2005
- Denso Corporation
- Yuji Ozaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for forming a casting which includes an insert
- Patent number 6,923,632
- Issue date Aug 2, 2005
- Denso Corporation
- Hiroshi Koyama
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Insert-molding method for obtaining a resin-molded product
- Patent number 6,428,732
- Issue date Aug 6, 2002
- Denso Corporation
- Tsutomu Onoue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming a casting which includes an insert
- Patent number 6,309,579
- Issue date Oct 30, 2001
- Nippondenso Co., Ltd.
- Hiroshi Koyama
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming a casting which includes an insert
- Patent number 6,063,321
- Issue date May 16, 2000
- Denso Corp.
- Hiroshi Koyama
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Sensor device and method for manufacturing the same
- Publication number 20070022808
- Publication date Feb 1, 2007
- DENSO CORPORATION
- Masaaki Tanaka
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device, method and apparatus for fabricating the same
- Publication number 20060108700
- Publication date May 25, 2006
- DENSO CORPORATION
- Shusaku Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin molded articles and method of manufacturing the same
- Publication number 20050285294
- Publication date Dec 29, 2005
- DENSO CORPORATION
- Yuji Ozaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin molded articles and method of manufacturing the same
- Publication number 20030215586
- Publication date Nov 20, 2003
- Yuji Ozaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for joining resinous products by effectively heating joining...
- Publication number 20030111765
- Publication date Jun 19, 2003
- Masato Ichikawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Insert-molding method and and device therefor
- Publication number 20020135101
- Publication date Sep 26, 2002
- Tsutomu Onoue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Insert molded product
- Publication number 20020058122
- Publication date May 16, 2002
- Tsuyoshi Arai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for forming a casting which includes an insert
- Publication number 20020017732
- Publication date Feb 14, 2002
- NIPPONDENSO CO., LTD.
- Hiroshi Koyama
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin molding for vehicle use and manufacturing method thereof
- Publication number 20010027883
- Publication date Oct 11, 2001
- Norihisa Sasano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Tsutomu Onoue

Person

Patents Grantslast 30 patents

Semiconductor device, method and apparatus for fabricating the same

Sensor device having a buffer element between the molding and the s...

Resin molded articles and method of manufacturing the same

Method and apparatus for forming a casting which includes an insert

Insert-molding method for obtaining a resin-molded product

Method for forming a casting which includes an insert

Method for forming a casting which includes an insert

Patents Applicationslast 30 patents

Sensor device and method for manufacturing the same

Semiconductor device, method and apparatus for fabricating the same

Resin molded articles and method of manufacturing the same

Resin molded articles and method of manufacturing the same

Method for joining resinous products by effectively heating joining...

Insert-molding method and and device therefor

Insert molded product

Method and apparatus for forming a casting which includes an insert

Resin molding for vehicle use and manufacturing method thereof