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Tsutomu Sasaki
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Futtsu, JP
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Patents Grants
last 30 patents
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Patent Grant
Lead-free solder alloy, solder ball and electronic member, and lead...
Patent number
8,562,906
Issue date
Oct 22, 2013
Nippon Steel & Sumikin Materials Co., Ltd.
Masamoto Tanaka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
SOI substrate, semiconductor substrate, and method for production t...
Patent number
7,320,925
Issue date
Jan 22, 2008
Siltronic AG
Tsutomu Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer holding, wafer support member, wafer boat and heat treatment...
Patent number
7,204,887
Issue date
Apr 17, 2007
Nippon Steel Corporation
Keisuke Kawamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SOI substrate
Patent number
7,084,459
Issue date
Aug 1, 2006
Nippon Steel Corporation
Tsutomu Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabrication of a SIMOX substrate
Patent number
6,740,565
Issue date
May 25, 2004
Nippon Steel Corporation
Atsuki Matsumura
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD...
Publication number
20090304545
Publication date
Dec 10, 2009
Nippon Steel Materials Co., Ltd.
Masamoto Tanaka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOI substrate, semiconductor substrate, and method for production t...
Publication number
20040253793
Publication date
Dec 16, 2004
Siltronic AG
Tsutomu Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Soi substrate
Publication number
20040018363
Publication date
Jan 29, 2004
Tsutomu Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer holder, wafer support member, wafer holding device, and heat...
Publication number
20030029570
Publication date
Feb 13, 2003
Keisuke Kawamura
H01 - BASIC ELECTRIC ELEMENTS