TSUTOMU TAKEDA

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component, and electronic component manufacturing method
- Patent number 10,643,976
- Issue date May 5, 2020
- NEC Corporation
- Yurika Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component cooling method
- Patent number 9,263,365
- Issue date Feb 16, 2016
- NEC Corporation
- Tsutomu Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor device
- Patent number 9,136,210
- Issue date Sep 15, 2015
- NEC Corporation
- Tsutomu Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having via and method forming a via in a wiring board
- Patent number 8,604,357
- Issue date Dec 10, 2013
- NEC Corporation
- Tsutomu Takeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,507,807
- Issue date Aug 13, 2013
- NEC Corporation
- Tsutomu Takeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method of manufacturing same
- Patent number 7,750,249
- Issue date Jul 6, 2010
- NEC Corporation
- Tsutomu Takeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
- Publication number 20180261577
- Publication date Sep 13, 2018
- NEC Corporation
- Yurika OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT COOLING METHOD
- Publication number 20140254099
- Publication date Sep 11, 2014
- NEC Corporation
- TSUTOMU TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR DEVICE
- Publication number 20120139010
- Publication date Jun 7, 2012
- TSUTOMU TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20110226516
- Publication date Sep 22, 2011
- TSUTOMU TAKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD HAVING VIA AND METHOD FORMING A VIA IN A WIRING BOARD
- Publication number 20100012366
- Publication date Jan 21, 2010
- TSUTOMU TAKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20080218985
- Publication date Sep 11, 2008
- TSUTOMU TAKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR