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Tsutomu UCHIMI
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Tokyo-To, JP
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Patents Grants
last 30 patents
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Patent Grant
Electroconductive paste composition and printed wiring board
Patent number
7,416,687
Issue date
Aug 26, 2008
Dai Nippon Printing Co., Ltd.
Tsutomu Uchimi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTROCONDUCTIVE PASTE COMPOSITION AND PRINTED WIRING BOARD
Publication number
20070228336
Publication date
Oct 4, 2007
Dai Nippon Printing Co., Ltd.
Tsutomu UCHIMI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR