Tsuyoshi Fukada

Person

Aichi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor and method for manufacturing the same
- Patent number 8,028,584
- Issue date Oct 4, 2011
- Denso Corporation
- Kiyoshi Otsuka
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor sensor having heater on insulation film and manufactu...
- Patent number 8,006,553
- Issue date Aug 30, 2011
- Denso Corporation
- Ryuichirou Abe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor
- Patent number 7,298,022
- Issue date Nov 20, 2007
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing movable portion of semiconductor device
- Patent number 7,214,625
- Issue date May 8, 2007
- Denso Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device capable of sensing dyn...
- Patent number 6,906,394
- Issue date Jun 14, 2005
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a moveable member therein and a protect...
- Patent number 6,787,866
- Issue date Sep 7, 2004
- Denso Corporation
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device capable of sensing dyn...
- Patent number 6,753,201
- Issue date Jun 22, 2004
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor dynamic quantity detecting sensor and manufacturing m...
- Patent number 6,718,824
- Issue date Apr 13, 2004
- Nippon Soken, Inc.
- Takeshi Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor device and method of manufacturing the same
- Patent number 6,444,543
- Issue date Sep 3, 2002
- Denso Corporation
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device produced by dicing
- Patent number 6,429,506
- Issue date Aug 6, 2002
- Denso Corporation
- Tetsuo Fujii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing semiconductor dynamic quantity sensor
- Patent number 6,423,563
- Issue date Jul 23, 2002
- Denso Corporation
- Tsuyoshi Fukada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Angular velocity sensor
- Patent number 6,308,567
- Issue date Oct 30, 2001
- Denso Corporation
- Hirofumi Higuchi
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor dynamic quantity sensor
- Patent number 6,287,885
- Issue date Sep 11, 2001
- Denso Corporation
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of etching silicon wafer and silicon wafer
- Patent number 6,284,670
- Issue date Sep 4, 2001
- Denso Corporation
- Yoshitsugu Abe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor physical quantity sensor and production method thereof
- Patent number 6,240,782
- Issue date Jun 5, 2001
- Denso Corporation
- Nobuyuki Kato
- G01 - MEASURING TESTING
Information Patent Grant
Electrochemical etching method for silicon substrate having PN junc...
- Patent number 6,194,236
- Issue date Feb 27, 2001
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor dynamical quantity sensor device having electrodes in...
- Patent number 6,151,966
- Issue date Nov 28, 2000
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabrication of a semiconductor sensor
- Patent number 6,143,584
- Issue date Nov 7, 2000
- Denso Corporation
- Tsuyoshi Fukada
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing an anodic bonded semiconductor sensor element
- Patent number 6,077,721
- Issue date Jun 20, 2000
- Nippondenso Co., Ltd.
- Tsuyoshi Fukada
- G01 - MEASURING TESTING
Information Patent Grant
Etching method for silicon substrates and semiconductor sensor
- Patent number 5,949,118
- Issue date Sep 7, 1999
- Nippondenso Co., Ltd.
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 5,920,106
- Issue date Jul 6, 1999
- Denso Corporation
- Nobukazu Oba
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor element mount and producing method therefor
- Patent number 5,736,061
- Issue date Apr 7, 1998
- Nippondenso Co. Ltd.
- Tsuyoshi Fukada
- G01 - MEASURING TESTING
Information Patent Grant
Method of etching semiconductor wafers
- Patent number 5,677,248
- Issue date Oct 14, 1997
- Nippondenso Co., Ltd.
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for producing semiconductor strain-sensitive sensor
- Patent number 5,654,244
- Issue date Aug 5, 1997
- Nippondenso Co., Ltd.
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Production method of a semiconductor dynamic sensor
- Patent number 5,643,803
- Issue date Jul 1, 1997
- Nippondenso Co., Ltd.
- Tsuyoshi Fukada
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a semiconductor strain sensor
- Patent number 5,622,901
- Issue date Apr 22, 1997
- Nippondenso Co., Ltd.
- Tsuyoshi Fukada
- G01 - MEASURING TESTING
Information Patent Grant
Plasma etching method and device manufacturing method thereby
- Patent number 5,575,887
- Issue date Nov 19, 1996
- Nippondenso Co., Ltd.
- Takahiko Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor dynamic sensor
- Patent number 5,549,785
- Issue date Aug 27, 1996
- Nippondenso Co., Ltd.
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing an acceleration sensor
- Patent number 5,525,549
- Issue date Jun 11, 1996
- Nippondenso Co., Ltd.
- Tsuyoshi Fukada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor strain sensor having improved resistance to bonding s...
- Patent number 5,408,112
- Issue date Apr 18, 1995
- Nippondenso Co., Ltd.
- Akira Tai
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor sensor having heater on insulation film and manufactu...
- Publication number 20100005877
- Publication date Jan 14, 2010
- DENSO CORPORATION
- Ryuichirou Abe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure sensor and method for manufacturing the same
- Publication number 20090049921
- Publication date Feb 26, 2009
- DENSO CORPORATION
- Kiyoshi Otsuka
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor sensor
- Publication number 20050156309
- Publication date Jul 21, 2005
- Tetsuo Fujii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for manufacturing movable portion of semiconductor device
- Publication number 20050054153
- Publication date Mar 10, 2005
- DENSO Corporation
- Kazushi Asami
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor device capable of sensing dyn...
- Publication number 20030201506
- Publication date Oct 30, 2003
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor device capable of sensing dyn...
- Publication number 20020177252
- Publication date Nov 28, 2002
- Hiroshi Muto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and method for producing the same by dicing
- Publication number 20020093076
- Publication date Jul 18, 2002
- Tetsuo Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor dynamic quantity detecting sensor and manufacturing m...
- Publication number 20020073779
- Publication date Jun 20, 2002
- Takeshi Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor sensor device and method of manufacturing the same
- Publication number 20010055876
- Publication date Dec 27, 2001
- Minekazu Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for manufacturing semiconductor dynamic quantity sensor
- Publication number 20010029060
- Publication date Oct 11, 2001
- DENSO Corporation
- Tsuyoshi Fukada
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Tsuyoshi Fukada

Person

Patents Grantslast 30 patents

Pressure sensor and method for manufacturing the same

Semiconductor sensor having heater on insulation film and manufactu...

Semiconductor sensor

Method for manufacturing movable portion of semiconductor device

Method of manufacturing semiconductor device capable of sensing dyn...

Semiconductor device having a moveable member therein and a protect...

Method of manufacturing semiconductor device capable of sensing dyn...

Semiconductor dynamic quantity detecting sensor and manufacturing m...

Semiconductor sensor device and method of manufacturing the same

Semiconductor device produced by dicing

Method for manufacturing semiconductor dynamic quantity sensor

Angular velocity sensor

Method for manufacturing semiconductor dynamic quantity sensor

Method of etching silicon wafer and silicon wafer

Semiconductor physical quantity sensor and production method thereof

Electrochemical etching method for silicon substrate having PN junc...

Semiconductor dynamical quantity sensor device having electrodes in...

Method for fabrication of a semiconductor sensor

Method of producing an anodic bonded semiconductor sensor element

Etching method for silicon substrates and semiconductor sensor

Semiconductor device and method for producing the same

Semiconductor element mount and producing method therefor

Method of etching semiconductor wafers

Process for producing semiconductor strain-sensitive sensor

Production method of a semiconductor dynamic sensor

Method of forming a semiconductor strain sensor

Plasma etching method and device manufacturing method thereby

Method of producing a semiconductor dynamic sensor

Method for producing an acceleration sensor

Semiconductor strain sensor having improved resistance to bonding s...

Patents Applicationslast 30 patents

Semiconductor sensor having heater on insulation film and manufactu...

Pressure sensor and method for manufacturing the same

Semiconductor sensor

Method for manufacturing movable portion of semiconductor device

Method of manufacturing semiconductor device capable of sensing dyn...

Method of manufacturing semiconductor device capable of sensing dyn...

Semiconductor device and method for producing the same by dicing

Semiconductor dynamic quantity detecting sensor and manufacturing m...

Semiconductor sensor device and method of manufacturing the same

Method for manufacturing semiconductor dynamic quantity sensor