Tsuyoshi Himori

Person

Mie, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method of manufacturing the circuit board
- Patent number 8,658,910
- Issue date Feb 25, 2014
- Panasonic Corporation
- Tetsuro Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate and manufacturing method of multilayer...
- Patent number 8,604,350
- Issue date Dec 10, 2013
- Panasonic Corporation
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, wiring board manufacturing method, and via paste
- Patent number 8,563,872
- Issue date Oct 22, 2013
- Panasonic Corporation
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 8,561,294
- Issue date Oct 22, 2013
- Panasonic Corporation
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 8,393,078
- Issue date Mar 12, 2013
- Panasonic Corporation
- Tsuyoshi Himori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board, mounted body, and electronic equipment using the same
- Patent number 7,667,977
- Issue date Feb 23, 2010
- Panasonic Corporation
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module component and method for manufacturing the same
- Patent number 7,659,604
- Issue date Feb 9, 2010
- Panasonic Corporation
- Joji Fujiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and manufacturing method thereof
- Patent number 7,510,759
- Issue date Mar 31, 2009
- Panasonic Corporation
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a module component having a plurality of penetrat...
- Patent number 7,421,781
- Issue date Sep 9, 2008
- Matsushita Electric Industrial Co., Ltd.
- Suzushi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module component and method of manufacturing the same
- Patent number 6,879,493
- Issue date Apr 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Suzushi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module component and method of manufacturing the same
- Patent number 6,806,428
- Issue date Oct 19, 2004
- Matsushita Electric Industrial Co., Ltd.
- Suzushi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistance wiring board and method for manufacturing the same
- Patent number 6,166,620
- Issue date Dec 26, 2000
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Inuzuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140124250
- Publication date May 8, 2014
- PANASONIC CORPORATION
- Akito Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANU...
- Publication number 20130327994
- Publication date Dec 12, 2013
- Tsuyoshi HIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANU...
- Publication number 20130327478
- Publication date Dec 12, 2013
- Tsuyoshi HIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE
- Publication number 20130299752
- Publication date Nov 14, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANU...
- Publication number 20130153138
- Publication date Jun 20, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
- Publication number 20130153276
- Publication date Jun 20, 2013
- Tetsuro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE
- Publication number 20130146817
- Publication date Jun 13, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20130097857
- Publication date Apr 25, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130068513
- Publication date Mar 21, 2013
- KYOTO ELEX CO., LTD.
- Shogo Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME
- Publication number 20130062107
- Publication date Mar 14, 2013
- PANASONIC CORPORATION
- Takayuki Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130008698
- Publication date Jan 10, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20120272520
- Publication date Nov 1, 2012
- Tsuyoshi Himori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE
- Publication number 20110290549
- Publication date Dec 1, 2011
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER...
- Publication number 20110278051
- Publication date Nov 17, 2011
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting Board, Mounted Body, and Electronic Equipment Using the Same
- Publication number 20080290497
- Publication date Nov 27, 2008
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module component and method for manufacturing the same
- Publication number 20060258050
- Publication date Nov 16, 2006
- Joji Fujiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part and manufacturing method thereof
- Publication number 20060118905
- Publication date Jun 8, 2006
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module component and method of manufacturing the same
- Publication number 20040165361
- Publication date Aug 26, 2004
- Matsushita Electric Industrial Co., Ltd.
- Suzushi Kimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module component and method of manufacturing the same
- Publication number 20020186552
- Publication date Dec 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Suzushi Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Tsuyoshi Himori

Person

Patents Grantslast 30 patents

Circuit board and method of manufacturing the circuit board

Multilayer wiring substrate and manufacturing method of multilayer...

Wiring board, wiring board manufacturing method, and via paste

Method of manufacturing circuit board

Method of manufacturing circuit board

Mounting board, mounted body, and electronic equipment using the same

Module component and method for manufacturing the same

Electronic part and manufacturing method thereof

Method of forming a module component having a plurality of penetrat...

Module component and method of manufacturing the same

Module component and method of manufacturing the same

Resistance wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANU...

METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANU...

REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE

METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANU...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

REUSE PASTE MANUFACTURING METHOD AND REUSE PASTE

METHOD OF MANUFACTURING CIRCUIT BOARD

WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME

MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

METHOD OF MANUFACTURING CIRCUIT BOARD

WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE

MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER...

Mounting Board, Mounted Body, and Electronic Equipment Using the Same

Module component and method for manufacturing the same

Electronic part and manufacturing method thereof

Module component and method of manufacturing the same

Module component and method of manufacturing the same