Tsuyoshi Honda

Person

Gunma-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition suitable to be applied by screen printing
- Patent number 8,110,066
- Issue date Feb 7, 2012
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Die bonding agent and a semiconductor device made by using the same
- Patent number 7,901,992
- Issue date Mar 8, 2011
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and a method of using the same
- Patent number 7,855,245
- Issue date Dec 21, 2010
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition and semiconductor device
- Patent number 7,169,474
- Issue date Jan 30, 2007
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device
- Patent number 6,794,058
- Issue date Sep 21, 2004
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone-modified epoxy or phenolic resin compositions and semicond...
- Patent number 6,709,753
- Issue date Mar 23, 2004
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive resin compositions and electronic parts using the same
- Patent number 6,680,007
- Issue date Jan 20, 2004
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film-type adhesive for electronic components, and electronic compon...
- Patent number 6,645,632
- Issue date Nov 11, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-transmissive epoxy resin composition and semiconductor device
- Patent number 6,627,328
- Issue date Sep 30, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, laminate film using the same, and semicond...
- Patent number 6,512,031
- Issue date Jan 28, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, laminate film using the same, and semicond...
- Patent number 6,383,659
- Issue date May 7, 2002
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, laminate film using the same, and semicond...
- Patent number 6,210,811
- Issue date Apr 3, 2001
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Epoxy Resin Composition and Die Bonding Material Comprising the Com...
- Publication number 20090133833
- Publication date May 28, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition suitable to be applied by screen printing
- Publication number 20080308225
- Publication date Dec 18, 2008
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition and a method of using the same
- Publication number 20080268255
- Publication date Oct 30, 2008
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Die bonding agent and a semiconductor device made by using the same
- Publication number 20080265439
- Publication date Oct 30, 2008
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition and semiconductor device
- Publication number 20050152773
- Publication date Jul 14, 2005
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin composition and semiconductor device
- Publication number 20040155334
- Publication date Aug 12, 2004
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip-chip type semiconductor device
- Publication number 20030144382
- Publication date Jul 31, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive resin compositions and electronic parts using the same
- Publication number 20030078322
- Publication date Apr 24, 2003
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Silicone-modified epoxy or phenolic resin compositions and semicond...
- Publication number 20020192477
- Publication date Dec 19, 2002
- Tsuyoshi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-transmissive epoxy resin composition and flip-chip type semic...
- Publication number 20020058742
- Publication date May 16, 2002
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Light-transmissive epoxy resin composition and semiconductor device
- Publication number 20020058145
- Publication date May 16, 2002
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Film-type adhesive for electronic components, and electronic compon...
- Publication number 20010031828
- Publication date Oct 18, 2001
- Tsuyoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Tsuyoshi Honda

Person

Patents Grantslast 30 patents

Adhesive composition suitable to be applied by screen printing

Die bonding agent and a semiconductor device made by using the same

Adhesive composition and a method of using the same

Epoxy resin composition and semiconductor device

Flip-chip type semiconductor device

Silicone-modified epoxy or phenolic resin compositions and semicond...

Conductive resin compositions and electronic parts using the same

Film-type adhesive for electronic components, and electronic compon...

Light-transmissive epoxy resin composition and semiconductor device

Epoxy resin composition, laminate film using the same, and semicond...

Epoxy resin composition, laminate film using the same, and semicond...

Epoxy resin composition, laminate film using the same, and semicond...

Patents Applicationslast 30 patents

Epoxy Resin Composition and Die Bonding Material Comprising the Com...

Adhesive composition suitable to be applied by screen printing

Adhesive composition and a method of using the same

Die bonding agent and a semiconductor device made by using the same

Liquid epoxy resin composition and semiconductor device

Epoxy resin composition and semiconductor device

Flip-chip type semiconductor device

Conductive resin compositions and electronic parts using the same

Silicone-modified epoxy or phenolic resin compositions and semicond...

Light-transmissive epoxy resin composition and flip-chip type semic...

Light-transmissive epoxy resin composition and semiconductor device

Film-type adhesive for electronic components, and electronic compon...