Tsuyoshi Ishizaka

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sheet for thermal bonding and sheet for thermal bonding with affixe...
- Patent number 10,301,509
- Issue date May 28, 2019
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealing sheet with separators on both surfaces, and method for manu...
- Patent number 10,128,131
- Issue date Nov 13, 2018
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally curable resin sheet for sealing semiconductor chip, and m...
- Patent number 9,659,883
- Issue date May 23, 2017
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing epoxy resin composition for semiconductor enca...
- Patent number 7,268,191
- Issue date Sep 11, 2007
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SHEET FOR THERMAL BONDING AND SHEET FOR THERMAL BONDING WITH AFFIXE...
- Publication number 20170369744
- Publication date Dec 28, 2017
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20170125373
- Publication date May 4, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...
- Publication number 20170040187
- Publication date Feb 9, 2017
- Nitto Denko Corporation
- Chie Iino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...
- Publication number 20170040287
- Publication date Feb 9, 2017
- NITTO DENKO CORPORATION
- Goji Shiga
- B32 - LAYERED PRODUCTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170032979
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...
- Publication number 20160300733
- Publication date Oct 13, 2016
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...
- Publication number 20160211228
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20100308477
- Publication date Dec 9, 2010
- Nitto Denko Corporation
- Shinya AKIZUKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for producing epoxy resin composition for semiconductor enca...
- Publication number 20050154152
- Publication date Jul 14, 2005
- NITTO DENKO CORPORATION
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tsuyoshi Ishizaka

Person

Patents Grantslast 30 patents

Sheet for thermal bonding and sheet for thermal bonding with affixe...

Sealing sheet with separators on both surfaces, and method for manu...

Thermally curable resin sheet for sealing semiconductor chip, and m...

Method for producing epoxy resin composition for semiconductor enca...

Patents Applicationslast 30 patents

SHEET FOR THERMAL BONDING AND SHEET FOR THERMAL BONDING WITH AFFIXE...

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...

ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...

THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

Method for producing epoxy resin composition for semiconductor enca...