Tsuyoshi KAMIMURA

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Niigata-shi, Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...
- Publication number 20240368374
- Publication date Nov 7, 2024
- Namics Corporation
- Makoto SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COMPRESSION MOLDING MATERIAL
- Publication number 20230203236
- Publication date Jun 29, 2023
- NAMICS CORPORATION
- Makoto SUZUKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...
- Publication number 20200194325
- Publication date Jun 18, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...
- Publication number 20200181392
- Publication date Jun 11, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...