Tsuyoshi Kida

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Film, laminate, semiconductor wafer with film layer, substrate for...
- Patent number 12,195,566
- Issue date Jan 14, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Takahito Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,935,803
- Issue date Mar 19, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,924,979
- Issue date Mar 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,053,382
- Issue date Jul 6, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Takenori Takiguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, laminate including the resin composition, semico...
- Patent number 10,808,103
- Issue date Oct 20, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Takenori Takiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,347,552
- Issue date Jul 9, 2019
- RENESAS ELECTRONICS CORPORATION
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,312,199
- Issue date Jun 4, 2019
- Renesas Electronics Corporation
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,141,273
- Issue date Nov 27, 2018
- Renesas Electronics Corporation
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,917,026
- Issue date Mar 13, 2018
- RENESAS ELECTRONICS CORPORATION
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,905,529
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip having a pillar electrode offset from the bonding pad
- Patent number 9,349,678
- Issue date May 24, 2016
- Renesas Electronics Corporation
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,054,093
- Issue date Jun 9, 2015
- Renesas Electronics Corporation
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,710,651
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,404,517
- Issue date Mar 26, 2013
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,207,619
- Issue date Jun 26, 2012
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing semiconductor module
- Patent number 8,067,835
- Issue date Nov 29, 2011
- Renesas Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment jig and heat treatment jig set
- Patent number 8,002,542
- Issue date Aug 23, 2011
- Renesas Electronics Corporation
- Daisuke Ejima
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Semiconductor wafer and manufacturing process for semiconductor device
- Patent number 7,759,223
- Issue date Jul 20, 2010
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and manufacturing process for semiconductor device
- Patent number 7,554,211
- Issue date Jun 30, 2009
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method therefor
- Patent number 7,514,800
- Issue date Apr 7, 2009
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of semiconductor element
- Patent number 6,313,540
- Issue date Nov 6, 2001
- NEC Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220389130
- Publication date Dec 8, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH...
- Publication number 20220380508
- Publication date Dec 1, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220344227
- Publication date Oct 27, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220332868
- Publication date Oct 20, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Takahito SEKIDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210277221
- Publication date Sep 9, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210147680
- Publication date May 20, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kohei HIGASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210147629
- Publication date May 20, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20190300678
- Publication date Oct 3, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Takenori TAKIGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20190276657
- Publication date Sep 12, 2019
- Mitsubishi Gas Chemical Company, Inc.
- Takenori TAKIGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180226362
- Publication date Aug 9, 2018
- RENESAS ELECTRONICS CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180151460
- Publication date May 31, 2018
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170213776
- Publication date Jul 27, 2017
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170047296
- Publication date Feb 16, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160260680
- Publication date Sep 8, 2016
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380345
- Publication date Dec 31, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150243614
- Publication date Aug 27, 2015
- Renesas Electronics Corporation
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150236003
- Publication date Aug 20, 2015
- RENESAS ELECTRONICS CORPORATION
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150179623
- Publication date Jun 25, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150179615
- Publication date Jun 25, 2015
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361430
- Publication date Dec 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120238060
- Publication date Sep 20, 2012
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110084384
- Publication date Apr 14, 2011
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20100244228
- Publication date Sep 30, 2010
- NEC Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE
- Publication number 20090227088
- Publication date Sep 10, 2009
- NEC ELECTRONICS CORPORATION
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for manufacturing semiconductor module
- Publication number 20090137084
- Publication date May 28, 2009
- NEC Electronics Corporation
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat treatment jig and heat treatment jig set
- Publication number 20080012193
- Publication date Jan 17, 2008
- NEC Electronics Corporation
- Daisuke Ejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module featuring solder balls having lower melting po...
- Publication number 20070278677
- Publication date Dec 6, 2007
- NEC Electronics Corporation
- Daisuke Ejima
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor module featuring solder balls having lower melting po...
- Publication number 20070246818
- Publication date Oct 25, 2007
- NED ELECTRONICS CORPORATION
- Daisuke Ejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and manufacturing process for semiconductor device
- Publication number 20050282360
- Publication date Dec 22, 2005
- NEC ELECTRONICS CORPORATION
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wire bonding method therefor
- Publication number 20030011038
- Publication date Jan 16, 2003
- Tsuyoshi Kida
- H01 - BASIC ELECTRIC ELEMENTS

Tsuyoshi Kida

Person

Patents Grantslast 30 patents

Film, laminate, semiconductor wafer with film layer, substrate for...

Resin composition, laminate, semiconductor wafer with resin composi...

Resin composition, laminate, semiconductor wafer with resin composi...

Resin composition, laminate, semiconductor wafer with resin composi...

Resin composition, laminate including the resin composition, semico...

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Method for manufacturing semiconductor device

Chip having a pillar electrode offset from the bonding pad

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Method and apparatus for manufacturing semiconductor module

Heat treatment jig and heat treatment jig set

Semiconductor wafer and manufacturing process for semiconductor device

Semiconductor wafer and manufacturing process for semiconductor device

Semiconductor device and wire bonding method therefor

Electrode structure of semiconductor element

Patents Applicationslast 30 patents

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH...

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR WAFER AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE

Method and apparatus for manufacturing semiconductor module

Heat treatment jig and heat treatment jig set

Semiconductor module featuring solder balls having lower melting po...

Semiconductor module featuring solder balls having lower melting po...

Semiconductor wafer and manufacturing process for semiconductor device

Semiconductor device and wire bonding method therefor