Tsuyoshi Kobayashi

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame
- Patent number 10,201,917
- Issue date Feb 12, 2019
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for mounting a light emitting element including a flat plat...
- Patent number 8,890,295
- Issue date Nov 18, 2014
- Shinko Electric Industries Co., Ltd.
- Toshiyuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, light emitting device and method for manufacturing subst...
- Patent number 8,786,065
- Issue date Jul 22, 2014
- Shinko Electric Industries Co., Ltd.
- Yasuyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounted structure
- Patent number 8,304,664
- Issue date Nov 6, 2012
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and stacked layer type semiconductor package
- Patent number 8,253,229
- Issue date Aug 28, 2012
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and manufacturing method thereof
- Patent number 8,134,444
- Issue date Mar 13, 2012
- Shinko Electronic Industries Co., Ltd.
- Michio Horiuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate and manufacturing method thereof, and semiconducto...
- Patent number 8,115,300
- Issue date Feb 14, 2012
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 8,096,049
- Issue date Jan 17, 2012
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 7,882,627
- Issue date Feb 8, 2011
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 7,847,384
- Issue date Dec 7, 2010
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a conductive post and wiring pattern
- Patent number 7,772,689
- Issue date Aug 10, 2010
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip-embedded substrate and method of manufacturing same
- Patent number 7,501,696
- Issue date Mar 10, 2009
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer and semiconductor device provided with columnar...
- Patent number 7,220,657
- Issue date May 22, 2007
- Shinko Electric Industries, Co., Ltd.
- Yoshihiro Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component
- Patent number 7,180,182
- Issue date Feb 20, 2007
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of producing same
- Patent number 6,548,326
- Issue date Apr 15, 2003
- Shinko Electronic Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making carrier substrate and semiconductor device
- Patent number 6,423,643
- Issue date Jul 23, 2002
- Shinko Electric Industries Co., Ltd.
- Yoshio Furuhata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of producing same
- Patent number 6,420,787
- Issue date Jul 16, 2002
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps by electroplating
- Patent number 6,413,404
- Issue date Jul 2, 2002
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Ihara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Capacitor, formed of a dielectric body having a high dielectric con...
- Patent number 6,201,684
- Issue date Mar 13, 2001
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film capacitor and semiconductor package or device carrying same
- Patent number 6,184,567
- Issue date Feb 6, 2001
- Shinko Electric Industries Co., Ltd.
- Akira Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for forming bumps by metal plating
- Patent number 6,030,512
- Issue date Feb 29, 2000
- Shinko Electric Industries, Co. Ltd.
- Yoshihiro Ihara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Capacitor, method for producing same and method for producing diele...
- Patent number 5,903,429
- Issue date May 11, 1999
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid electrolyte gas sensor and process of producing joined body o...
- Patent number 5,547,556
- Issue date Aug 20, 1996
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Solid electrolyte gas sensor
- Patent number 5,482,609
- Issue date Jan 9, 1996
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME
- Publication number 20180236696
- Publication date Aug 23, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURI...
- Publication number 20170162520
- Publication date Jun 8, 2017
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD FOR MANUFACTURING PACKAGE
- Publication number 20130277701
- Publication date Oct 24, 2013
- Shinko Electric Industries Co., LTD.
- Toshiyuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate, Light Emitting Device and Method for Manufacturing Subst...
- Publication number 20130113015
- Publication date May 9, 2013
- Shinko Electric Industries Co., LTD.
- Yasuyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a multilayer wiring board
- Publication number 20110099806
- Publication date May 5, 2011
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...
- Publication number 20110095419
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...
- Publication number 20110095433
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductor and Manufacturing Method Thereof
- Publication number 20110080247
- Publication date Apr 7, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE
- Publication number 20100294552
- Publication date Nov 25, 2010
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and stacked layer type semiconductor package
- Publication number 20080290491
- Publication date Nov 27, 2008
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a multilayer wiring board
- Publication number 20080168652
- Publication date Jul 17, 2008
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTO...
- Publication number 20070290306
- Publication date Dec 20, 2007
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring substrate and method of connecting the same
- Publication number 20070200211
- Publication date Aug 30, 2007
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20070052071
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20070052083
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip-embedded substrate and method of manufacturing same
- Publication number 20060022332
- Publication date Feb 2, 2006
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component
- Publication number 20040238951
- Publication date Dec 2, 2004
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and semiconductor device provided with columnar...
- Publication number 20030096495
- Publication date May 22, 2003
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process of producing same
- Publication number 20020041037
- Publication date Apr 11, 2002
- Shinko Electronic Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Tsuyoshi Kobayashi

Person

Patents Grantslast 30 patents

Lead frame

Electronic part embedded substrate and method of producing an elect...

Electronic part embedded substrate and method of producing an elect...

Chip embedded substrate and method of producing the same

Package for mounting a light emitting element including a flat plat...

Chip embedded substrate and method of producing the same

Substrate, light emitting device and method for manufacturing subst...

Electronic component mounted structure

Semiconductor package and stacked layer type semiconductor package

Inductor and manufacturing method thereof

Wiring substrate and manufacturing method thereof, and semiconducto...

Method of manufacturing a multilayer wiring board

Chip embedded substrate and method of producing the same

Method of manufacturing a multilayer wiring board

Semiconductor package and manufacturing method thereof

Semiconductor package with a conductive post and wiring pattern

Semiconductor chip-embedded substrate and method of manufacturing same

Semiconductor wafer and semiconductor device provided with columnar...

Semiconductor component

Semiconductor device and process of producing same

Process of making carrier substrate and semiconductor device

Semiconductor device and process of producing same

Method of forming bumps by electroplating

Capacitor, formed of a dielectric body having a high dielectric con...

Film capacitor and semiconductor package or device carrying same

Device for forming bumps by metal plating

Capacitor, method for producing same and method for producing diele...

Solid electrolyte gas sensor and process of producing joined body o...

Solid electrolyte gas sensor

Patents Applicationslast 30 patents

LEAD FRAME

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURI...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

PACKAGE AND METHOD FOR MANUFACTURING PACKAGE

Substrate, Light Emitting Device and Method for Manufacturing Subst...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

Method of manufacturing a multilayer wiring board

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...

Inductor and Manufacturing Method Thereof

ELECTRONIC COMPONENT MOUNTED STRUCTURE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

Semiconductor package and stacked layer type semiconductor package

Method of manufacturing a multilayer wiring board

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTO...

Multilayer wiring substrate and method of connecting the same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor chip-embedded substrate and method of manufacturing same

Semiconductor component

Semiconductor wafer and semiconductor device provided with columnar...

Semiconductor device and process of producing same