Tsuyoshi Miura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board, air conditioner, and method for manufacturin...
- Patent number 10,897,809
- Issue date Jan 19, 2021
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer insulated wire and method of manufacturing the same
- Patent number 10,400,174
- Issue date Sep 3, 2019
- Hitachi Metals, Ltd.
- Tsuyoshi Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method of soldering quad flat package IC, and...
- Patent number 8,975,533
- Issue date Mar 10, 2015
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual inline lead-type electronic-part-mounted printed circuit board...
- Patent number 8,309,862
- Issue date Nov 13, 2012
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-type electronic-part-mounted printed circuit board, method of...
- Patent number 7,710,738
- Issue date May 4, 2010
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Four-way lead flat package IC-mount printed circuit board, method o...
- Patent number 7,405,945
- Issue date Jul 29, 2008
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220310795
- Publication date Sep 29, 2022
- Hitachi Metals, Ltd.
- Tsuyoshi MIURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURIN...
- Publication number 20200084874
- Publication date Mar 12, 2020
- Mitsubishi Electric Corporation
- Tsuyoshi MIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20190281704
- Publication date Sep 12, 2019
- Mitsubishi Electric Corporation
- Tsuyoshi MIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Insulated Wire and Method of Manufacturing the Same
- Publication number 20190241812
- Publication date Aug 8, 2019
- Hitachi Metals, Ltd.
- Tsuyoshi MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED WIRE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170032868
- Publication date Feb 2, 2017
- Hitachi Metals, Ltd.
- Shigehiro Morishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, METHOD OF SOLDERING QUAD FLAT PACKAGE IC, AND...
- Publication number 20120181069
- Publication date Jul 19, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Tsuyoshi MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL INLINE LEAD-TYPE ELECTRONIC-PART-MOUNTED PRINTED CIRCUIT BOARD...
- Publication number 20100193233
- Publication date Aug 5, 2010
- MITSUBISHI ELECTRIC CORPORATION
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board, air conditioner, and method of soldering prin...
- Publication number 20090145644
- Publication date Jun 11, 2009
- MITSUBISHI ELECTRIC CORPORATION
- Tsuyoshi Miura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead-type electronic-part-mounted printed circuit board, method of...
- Publication number 20070051778
- Publication date Mar 8, 2007
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Four-way lead flat package IC-mount printed circuit board, method o...
- Publication number 20070034403
- Publication date Feb 15, 2007
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Tsuyoshi Miura

Person

Patents Grantslast 30 patents

Printed circuit board, air conditioner, and method for manufacturin...

Multi-layer insulated wire and method of manufacturing the same

Printed wiring board, method of soldering quad flat package IC, and...

Dual inline lead-type electronic-part-mounted printed circuit board...

Lead-type electronic-part-mounted printed circuit board, method of...

Four-way lead flat package IC-mount printed circuit board, method o...

Patents Applicationslast 30 patents

SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PRINTED CIRCUIT BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURIN...

METHOD OF MANUFACTURING PRINTED WIRING BOARD

Multi-Layer Insulated Wire and Method of Manufacturing the Same

INSULATED WIRE AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD, METHOD OF SOLDERING QUAD FLAT PACKAGE IC, AND...

DUAL INLINE LEAD-TYPE ELECTRONIC-PART-MOUNTED PRINTED CIRCUIT BOARD...

Printed wiring board, air conditioner, and method of soldering prin...

Lead-type electronic-part-mounted printed circuit board, method of...

Four-way lead flat package IC-mount printed circuit board, method o...