Tsuyoshi Sahoda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing substrate
- Patent number 7,285,492
- Issue date Oct 23, 2007
- Ebara Corporation
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper plating bath and plating method for substrate using the copp...
- Patent number 6,800,188
- Issue date Oct 5, 2004
- Ebara-Udylite Co., Ltd.
- Hideki Hagiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Copper Plating Bath and Plating Method
- Publication number 20080264798
- Publication date Oct 30, 2008
- EBARA CORPORATION
- Tsutomu Nakada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20060234499
- Publication date Oct 19, 2006
- Akira Kodera
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060081478
- Publication date Apr 20, 2006
- Tsuyoshi Sahoda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for processing substrate
- Publication number 20050245080
- Publication date Nov 3, 2005
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for determining the concentrations of additive...
- Publication number 20050208201
- Publication date Sep 22, 2005
- Makoto Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method, plating apparatus and a method of forming fine circ...
- Publication number 20050126919
- Publication date Jun 16, 2005
- Makoto Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plating bath and plating method
- Publication number 20050072683
- Publication date Apr 7, 2005
- EBARA CORPORATION
- Tsutomu Nakada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating solution
- Publication number 20050045486
- Publication date Mar 3, 2005
- Tsuyoshi Sahoda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plating bath and plating method for substrate using the copp...
- Publication number 20030106802
- Publication date Jun 12, 2003
- Hideki Hagiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tsuyoshi Sahoda

Person

Patents Grantslast 30 patents

Method for processing substrate

Copper plating bath and plating method for substrate using the copp...

Patents Applicationslast 30 patents

Copper Plating Bath and Plating Method

Substrate processing method and substrate processing apparatus

Plating apparatus and plating method

Method and apparatus for processing substrate

Method and apparatus for determining the concentrations of additive...

Plating method, plating apparatus and a method of forming fine circ...

Copper plating bath and plating method

Plating method and plating solution

Copper plating bath and plating method for substrate using the copp...