Tsuyoshi Shintate

Person

Matsuyama-machi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a layer, method for manufacturing an active matr...
- Patent number 8,888,229
- Issue date Nov 18, 2014
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a conductive post for a multilayered wiring subs...
- Patent number 8,322,033
- Issue date Dec 4, 2012
- Seiko Epson Corporation
- Toshimitsu Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layered structure, method for manufacturin...
- Patent number 7,972,651
- Issue date Jul 5, 2011
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern forming system, pattern forming method, and electronic appa...
- Patent number 7,871,666
- Issue date Jan 18, 2011
- Seiko Epson Corporation
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Manufacturing method of electronic board and multilayer wiring board
- Patent number 7,805,836
- Issue date Oct 5, 2010
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic substrate
- Patent number 7,793,411
- Issue date Sep 14, 2010
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer structure forming method, method of manufacturing wiring...
- Patent number 7,767,252
- Issue date Aug 3, 2010
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered structure forming method, method of manufacturing wir...
- Patent number 7,723,243
- Issue date May 25, 2010
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming wiring pattern, wiring pattern, and electronic a...
- Patent number 7,629,019
- Issue date Dec 8, 2009
- Seiko Epson Corporation
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming layer
- Patent number 7,541,063
- Issue date Jun 2, 2009
- Seiko Epson Corporation
- Tsuyoshi Shintate
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing a wiring substrate and an electronic instru...
- Patent number 7,538,031
- Issue date May 26, 2009
- Seiko Epson Corporation
- Noboru Uehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern forming system, pattern forming method, and electronic appa...
- Patent number 7,462,241
- Issue date Dec 9, 2008
- Seiko Epson Corporation
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring pattern formation method, wiring pattern, and electronic device
- Patent number 7,416,759
- Issue date Aug 26, 2008
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring pattern formation method, manufacturing method for multi lay...
- Patent number 7,316,974
- Issue date Jan 8, 2008
- Seiko Epson Corporation
- Noboru Uehara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layered structure forming method, method of manufacturing wir...
- Patent number 7,250,377
- Issue date Jul 31, 2007
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PATTERN FORMING SYSTEM, PATTERN FORMING METHOD, AND ELECTRONIC APPA...
- Publication number 20110097515
- Publication date Apr 28, 2011
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, M...
- Publication number 20090162536
- Publication date Jun 25, 2009
- SEIKO EPSON CORPORATION
- Toshimitsu HIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTIL...
- Publication number 20090077798
- Publication date Mar 26, 2009
- SEIKO EPSON CORPORATION
- Toshimitsu HIRAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WI...
- Publication number 20090071706
- Publication date Mar 19, 2009
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pattern forming system, pattern forming method, and electronic appa...
- Publication number 20090035453
- Publication date Feb 5, 2009
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING...
- Publication number 20080172868
- Publication date Jul 24, 2008
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC BOARD AND MULTILAYER WIRING BOARD
- Publication number 20080119067
- Publication date May 22, 2008
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE
- Publication number 20080104832
- Publication date May 8, 2008
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-layered structure forming method, method of manufacturing wir...
- Publication number 20070141828
- Publication date Jun 21, 2007
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING LAYER
- Publication number 20070057992
- Publication date Mar 15, 2007
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FORMING A LAYER, METHOD FOR MANUFACTURING AN ACTIVE MATR...
- Publication number 20070046718
- Publication date Mar 1, 2007
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- G02 - OPTICS
Information Patent Application
MULTILAYERED STRUCTURE FORMING METHOD
- Publication number 20060292769
- Publication date Dec 28, 2006
- SEIKO EPSON CORPORATION
- Kenji Wada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Wiring pattern formation method, manufacturing method for multi lay...
- Publication number 20060127567
- Publication date Jun 15, 2006
- Seiko Epson Corporation
- Noboru Uehara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pattern forming system, pattern forming method, and electronic appa...
- Publication number 20060087545
- Publication date Apr 27, 2006
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for forming wiring pattern, wiring pattern, and electronic a...
- Publication number 20060065955
- Publication date Mar 30, 2006
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a wiring substrate and an electronic instru...
- Publication number 20060068525
- Publication date Mar 30, 2006
- Seiko Epson Corporation
- Noboru Uehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer structure forming method, method of manufacturing wiring...
- Publication number 20060068573
- Publication date Mar 30, 2006
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring pattern formation method, wiring pattern, and electronic device
- Publication number 20060068616
- Publication date Mar 30, 2006
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming multi-layered structure, method for manufacturin...
- Publication number 20060060944
- Publication date Mar 23, 2006
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered structure forming method, method of manufacturing wir...
- Publication number 20060040489
- Publication date Feb 23, 2006
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pattern forming method, circuit substrate and electronic apparatus
- Publication number 20050208433
- Publication date Sep 22, 2005
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pattern formation method, pattern formation system, and electronic...
- Publication number 20050200684
- Publication date Sep 15, 2005
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Tsuyoshi Shintate

Person

Patents Grantslast 30 patents

Method for forming a layer, method for manufacturing an active matr...

Method for forming a conductive post for a multilayered wiring subs...

Method for forming multi-layered structure, method for manufacturin...

Pattern forming system, pattern forming method, and electronic appa...

Manufacturing method of electronic board and multilayer wiring board

Method for manufacturing electronic substrate

Multilayer structure forming method, method of manufacturing wiring...

Multi-layered structure forming method, method of manufacturing wir...

Method for forming wiring pattern, wiring pattern, and electronic a...

Method for forming layer

Method of manufacturing a wiring substrate and an electronic instru...

Pattern forming system, pattern forming method, and electronic appa...

Wiring pattern formation method, wiring pattern, and electronic device

Wiring pattern formation method, manufacturing method for multi lay...

Multi-layered structure forming method, method of manufacturing wir...

Patents Applicationslast 30 patents

PATTERN FORMING SYSTEM, PATTERN FORMING METHOD, AND ELECTRONIC APPA...

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, M...

METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTIL...

METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WI...

Pattern forming system, pattern forming method, and electronic appa...

METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING...

MANUFACTURING METHOD OF ELECTRONIC BOARD AND MULTILAYER WIRING BOARD

METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE

Multi-layered structure forming method, method of manufacturing wir...

METHOD FOR FORMING LAYER

METHOD FOR FORMING A LAYER, METHOD FOR MANUFACTURING AN ACTIVE MATR...

MULTILAYERED STRUCTURE FORMING METHOD

Wiring pattern formation method, manufacturing method for multi lay...

Pattern forming system, pattern forming method, and electronic appa...

Method for forming wiring pattern, wiring pattern, and electronic a...

Method of manufacturing a wiring substrate and an electronic instru...

Multilayer structure forming method, method of manufacturing wiring...

Wiring pattern formation method, wiring pattern, and electronic device

Method for forming multi-layered structure, method for manufacturin...

Multi-layered structure forming method, method of manufacturing wir...

Pattern forming method, circuit substrate and electronic apparatus

Pattern formation method, pattern formation system, and electronic...