Tsuyoshi Tokuoka

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Fujisawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and method
- Patent number 8,012,332
- Issue date Sep 6, 2011
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method
- Patent number 7,402,227
- Issue date Jul 22, 2008
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and apparatus
- Patent number 7,118,664
- Issue date Oct 10, 2006
- Ebara Corporation
- Junichiro Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and apparatus
- Patent number 6,716,332
- Issue date Apr 6, 2004
- Ebara Corporation
- Junichiro Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor element and fabricating method thereof
- Patent number 6,569,752
- Issue date May 27, 2003
- Kabushiki Kaisha Toshiba
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating a substrate
- Patent number 6,544,585
- Issue date Apr 8, 2003
- Ebara Corporation
- Fumio Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS AND METHOD
- Publication number 20080245669
- Publication date Oct 9, 2008
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20050082163
- Publication date Apr 21, 2005
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and apparatus
- Publication number 20040159550
- Publication date Aug 19, 2004
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20020027080
- Publication date Mar 7, 2002
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR