Tsuyoshi YODA

Person

Matsumoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, and M...
- Patent number 10,377,134
- Issue date Aug 13, 2019
- Seiko Epson Corporation
- Motoki Takabe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing a liquid discharging head or portion thereof
- Patent number 10,121,957
- Issue date Nov 6, 2018
- Seiko Epson Corporation
- Toshiaki Hamaguchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting head, and manufacturing method of liquid ejecting head
- Patent number 9,902,150
- Issue date Feb 27, 2018
- Seiko Epson Corporation
- Yasuyuki Matsumoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Conduction structure, method of manufacturing conduction structure,...
- Patent number 9,822,452
- Issue date Nov 21, 2017
- Seiko Epson Corporation
- Tsuyoshi Yoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conduction structure, method of manufacturing conduction structure,...
- Patent number 9,708,715
- Issue date Jul 18, 2017
- Seiko Epson Corporation
- Tsuyoshi Yoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring structure, method of manufacturing wiring structure, liquid...
- Patent number 9,579,892
- Issue date Feb 28, 2017
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring mounting structure and method of manufacturing the same, and...
- Patent number 9,517,624
- Issue date Dec 13, 2016
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 9,437,489
- Issue date Sep 6, 2016
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate, method of manufacturing substrate, semiconductor device,...
- Patent number 9,349,673
- Issue date May 24, 2016
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method of manufacturing wiring structure, liquid...
- Patent number 9,254,653
- Issue date Feb 9, 2016
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device, having through electrodes, a manufacturing me...
- Patent number 9,257,404
- Issue date Feb 9, 2016
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-mounted substrate, infrared light sensor and through electro...
- Patent number 9,070,637
- Issue date Jun 30, 2015
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid droplet ejecting head, printing apparatus and method of manu...
- Patent number 8,960,861
- Issue date Feb 24, 2015
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Mounted structure, liquid droplet ejection head, liquid droplet eje...
- Patent number 8,839,520
- Issue date Sep 23, 2014
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device having through electrodes, a manufacturing met...
- Patent number 8,796,823
- Issue date Aug 5, 2014
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, piezoelectric oscillator and gyrosensor
- Patent number 8,621,926
- Issue date Jan 7, 2014
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having through electrodes, a manufacturing met...
- Patent number 8,330,256
- Issue date Dec 11, 2012
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure, liquid droplet ejection head, liquid droplet eje...
- Patent number 7,784,913
- Issue date Aug 31, 2010
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing substrate joint body, substrate joint body...
- Patent number 7,521,797
- Issue date Apr 21, 2009
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device mounting structure, device mounting method, electronic appar...
- Patent number 7,390,079
- Issue date Jun 24, 2008
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor substrate and method for m...
- Patent number 7,326,639
- Issue date Feb 5, 2008
- Seiko Epson Corporation
- Suguru Akagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating bumps utilizing a resist layer having photose...
- Patent number 6,900,117
- Issue date May 31, 2005
- Seiko Epson Corporation
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180250935
- Publication date Sep 6, 2018
- SEIKO EPSON CORPORATION
- Shuichi Tanaka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND M...
- Publication number 20170368826
- Publication date Dec 28, 2017
- SEIKO EPSON CORPORATION
- Motoki TAKABE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING HEAD, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD
- Publication number 20170106653
- Publication date Apr 20, 2017
- SEIKO EPSON CORPORATION
- Yasuyuki MATSUMOTO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MANUFACTURING METHOD OF PIEZOELECTRIC ELEMENT, MANUFACTURING METHOD...
- Publication number 20160035966
- Publication date Feb 4, 2016
- SEIKO EPSON CORPORATION
- Toshiaki Hamaguchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING WIRING STRUCTURE, LIQUID...
- Publication number 20150343769
- Publication date Dec 3, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING WIRING STRUCTURE, LIQUID...
- Publication number 20150343768
- Publication date Dec 3, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20150231882
- Publication date Aug 20, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...
- Publication number 20150230333
- Publication date Aug 13, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...
- Publication number 20150224772
- Publication date Aug 13, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...
- Publication number 20140306342
- Publication date Oct 16, 2014
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID DROPLET EJECTING HEAD, PRINTING APPARATUS AND METHOD OF MANU...
- Publication number 20140085383
- Publication date Mar 27, 2014
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING A WIRING SUBSTRATE
- Publication number 20140082936
- Publication date Mar 27, 2014
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE, SEMICONDUCTOR DEVICE,...
- Publication number 20140008816
- Publication date Jan 9, 2014
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20130075896
- Publication date Mar 28, 2013
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE-MOUNTED SUBSTRATE, INFRARED LIGHT SENSOR AND THROUGH ELECTRO...
- Publication number 20120235261
- Publication date Sep 20, 2012
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, PIEZOELECTRIC OSCILLATOR, GYROSENSOR AND MANUFACT...
- Publication number 20110271757
- Publication date Nov 10, 2011
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOUNTED STRUCTURE, LIQUID DROPLET EJECTION HEAD, LIQUID DROPLET EJE...
- Publication number 20100291715
- Publication date Nov 18, 2010
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20100123256
- Publication date May 20, 2010
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device mounting structure, device mounting method, electronic appar...
- Publication number 20070042613
- Publication date Feb 22, 2007
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Mounted structure, liquid droplet ejection head, liquid droplet eje...
- Publication number 20060164468
- Publication date Jul 27, 2006
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Film forming method, electronic device and electronic apparatus
- Publication number 20060062978
- Publication date Mar 23, 2006
- Shinichi Yotsuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a semiconductor substrate and method for m...
- Publication number 20050250306
- Publication date Nov 10, 2005
- Suguru Akagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing substrate joint body, substrate joint body...
- Publication number 20050205992
- Publication date Sep 22, 2005
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump forming method, semiconductor device and method of manufacturi...
- Publication number 20020061641
- Publication date May 23, 2002
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- H01 - BASIC ELECTRIC ELEMENTS

Tsuyoshi YODA

Person

Patents Grantslast 30 patents

MEMS device, liquid ejecting head, liquid ejecting apparatus, and M...

Method for manufacturing a liquid discharging head or portion thereof

Liquid ejecting head, and manufacturing method of liquid ejecting head

Conduction structure, method of manufacturing conduction structure,...

Conduction structure, method of manufacturing conduction structure,...

Wiring structure, method of manufacturing wiring structure, liquid...

Wiring mounting structure and method of manufacturing the same, and...

Method of manufacturing a wiring substrate

Substrate, method of manufacturing substrate, semiconductor device,...

Wiring structure, method of manufacturing wiring structure, liquid...

Semiconductor device, having through electrodes, a manufacturing me...

Device-mounted substrate, infrared light sensor and through electro...

Liquid droplet ejecting head, printing apparatus and method of manu...

Mounted structure, liquid droplet ejection head, liquid droplet eje...

Semiconductor device having through electrodes, a manufacturing met...

Wiring substrate, piezoelectric oscillator and gyrosensor

Semiconductor device having through electrodes, a manufacturing met...

Mounted structure, liquid droplet ejection head, liquid droplet eje...

Method of manufacturing substrate joint body, substrate joint body...

Device mounting structure, device mounting method, electronic appar...

Method for manufacturing a semiconductor substrate and method for m...

Method of fabricating bumps utilizing a resist layer having photose...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND M...

LIQUID EJECTING HEAD, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD

MANUFACTURING METHOD OF PIEZOELECTRIC ELEMENT, MANUFACTURING METHOD...

WIRING STRUCTURE, METHOD OF MANUFACTURING WIRING STRUCTURE, LIQUID...

WIRING STRUCTURE, METHOD OF MANUFACTURING WIRING STRUCTURE, LIQUID...

WIRING MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...

CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...

CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...

SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...

LIQUID DROPLET EJECTING HEAD, PRINTING APPARATUS AND METHOD OF MANU...

METHOD OF MANUFACTURING A WIRING SUBSTRATE

SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE, SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

DEVICE-MOUNTED SUBSTRATE, INFRARED LIGHT SENSOR AND THROUGH ELECTRO...

WIRING SUBSTRATE, PIEZOELECTRIC OSCILLATOR, GYROSENSOR AND MANUFACT...

MOUNTED STRUCTURE, LIQUID DROPLET EJECTION HEAD, LIQUID DROPLET EJE...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

Device mounting structure, device mounting method, electronic appar...

Mounted structure, liquid droplet ejection head, liquid droplet eje...

Film forming method, electronic device and electronic apparatus

Method for manufacturing a semiconductor substrate and method for m...

Method of manufacturing substrate joint body, substrate joint body...

Bump forming method, semiconductor device and method of manufacturi...