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Tsz Kong Cheung

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Patents Grantslast 30 patents

  • Information Patent Grant

    Polymer-bonded magnetic materials
    • Patent number 8,277,678
    • Issue date Oct 2, 2012
    • The Hong Kong Polytechnic University
    • Ka Wai Eric Cheng
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents