Tsz Yin Ho

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Tuen Mun, HK

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit leaded stacked package system
- Patent number 8,513,542
- Issue date Aug 20, 2013
- Stats Chippac Ltd.
- Heap Hoe Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package in package system
- Patent number 8,164,172
- Issue date Apr 24, 2012
- Stats Chippac Ltd.
- Tsz Yin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package on package system
- Patent number 7,986,043
- Issue date Jul 26, 2011
- Stats Chippac Ltd.
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package in package system
- Patent number 7,981,702
- Issue date Jul 19, 2011
- Stats Chippac Ltd.
- Tsz Yin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module package and fabrication method
- Patent number 7,928,564
- Issue date Apr 19, 2011
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including die stacking
- Patent number 7,619,314
- Issue date Nov 17, 2009
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including die stacking
- Patent number 7,298,038
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM
- Publication number 20110248411
- Publication date Oct 13, 2011
- Tsz Yin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
- Publication number 20090014866
- Publication date Jan 15, 2009
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE STACKING
- Publication number 20080029862
- Publication date Feb 7, 2008
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
- Publication number 20070210443
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT LEADED STACKED PACKAGE SYSTEM
- Publication number 20070209834
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Heap Hoe Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM
- Publication number 20070210424
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Tsz Yin Ho
- H01 - BASIC ELECTRIC ELEMENTS