Tsz Yin Ho

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system including high-density small foot...
- Patent number 7,622,325
- Issue date Nov 24, 2009
- Stats Chippac Ltd.
- IL Kwon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip module package and fabrication method
- Patent number 7,445,955
- Issue date Nov 4, 2008
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module package and fabrication method
- Patent number 6,943,057
- Issue date Sep 13, 2005
- Stats Chippac Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE STACKING
- Publication number 20070200205
- Publication date Aug 30, 2007
- STATS ChipPAC Ltd.
- Dario S. Filoteo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HIGH-DENSITY SMALL FOOT...
- Publication number 20070096282
- Publication date May 3, 2007
- STATS ChipPAC Ltd.
- IL Kwon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
- Publication number 20060043560
- Publication date Mar 2, 2006
- STATS ChipPAC Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS