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Tu Cheng City, TW
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last 30 patents
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Patent Grant
Method and apparatus for flip chip device assembly by radiant heating
Patent number
7,056,767
Issue date
Jun 6, 2006
Texas Instruments Incorporated
Jimmy Liang
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Method and apparatus for flip chip device assembly by radiant heating
Publication number
20040108600
Publication date
Jun 10, 2004
Jimmy Liang
H01 - BASIC ELECTRIC ELEMENTS