Tu Hong

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma enhanced wafer soak for thin film deposition
- Patent number 12,014,921
- Issue date Jun 18, 2024
- Lam Research Corporation
- Arul N. Dhas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTR...
- Publication number 20250022740
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Liwei AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICK...
- Publication number 20240344201
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Dong WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER LIFT PIN MECHANISM FOR PREVENTING LOCAL BACKSIDE DEPOSITION
- Publication number 20230099332
- Publication date Mar 30, 2023
- LAM RESEARCH CORPORATION
- Andrew H. Breninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDEPENDENTLY ADJUSTABLE FLOWPATH CONDUCTANCE IN MULTI-STATION SEMI...
- Publication number 20220228263
- Publication date Jul 21, 2022
- LAM RESEARCH CORPORATION
- Michael Philip Roberts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED WAFER SOAK FOR THIN FILM DEPOSITION
- Publication number 20210366705
- Publication date Nov 25, 2021
- LAM RESEARCH CORPORATION
- Arul N. Dhas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTINUOUS PLASMA FOR FILM DEPOSITION AND SURFACE TREATMENT
- Publication number 20210335606
- Publication date Oct 28, 2021
- LAM RESEARCH CORPORATION
- Arul N. Dhas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Plasma enhanced wafer soak for thin film deposition

Patents Applicationslast 30 patents

SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTR...

SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICK...

WAFER LIFT PIN MECHANISM FOR PREVENTING LOCAL BACKSIDE DEPOSITION

INDEPENDENTLY ADJUSTABLE FLOWPATH CONDUCTANCE IN MULTI-STATION SEMI...

PLASMA ENHANCED WAFER SOAK FOR THIN FILM DEPOSITION

CONTINUOUS PLASMA FOR FILM DEPOSITION AND SURFACE TREATMENT