Tu-Tang Pan

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Tainan, TW

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Patents Applicationslast 30 patents

Information Patent Application
Thin IC package for improving heat dissipation from chip backside
- Publication number 20070035008
- Publication date Feb 15, 2007
- ChipMOS TECHNOLOGIES (Bermuda) LTD. ChipMOS TECHNOLOGIES INC.
- Cheng-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS