Tuan A. Vo

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,620,481
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with structures for cooling fluid retention
- Patent number 9,564,386
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure
- Patent number 9,502,288
- Issue date Nov 22, 2016
- GLOBALFOUNDRIES Inc.
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manganese oxide hard mask for etching dielectric materials
- Patent number 9,472,457
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Wei Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer bonding for 3D device packaging fabrication
- Patent number 9,412,629
- Issue date Aug 9, 2016
- GLOBALFOUNDRIES Inc.
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling of semiconductor chips utilizing small scale structures
- Patent number 9,263,366
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manganese oxide hard mask for etching dielectric materials
- Patent number 9,142,488
- Issue date Sep 22, 2015
- International Business Machines Corporation
- Wei Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Titanium oxynitride hard mask for lithographic patterning
- Patent number 9,087,876
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,064,937
- Issue date Jun 23, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distorting donor wafer to corresponding distortion of host wafer
- Patent number 9,058,974
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Wei Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cyclical physical vapor deposition of dielectric layers
- Patent number 9,053,926
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Paul Jamison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion/etching protection in integration circuit fabrications
- Patent number 9,054,109
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-to-wafer oxide fusion bonding
- Patent number 9,028,628
- Issue date May 12, 2015
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic material stack including a metal-compound hard mask
- Patent number 8,986,921
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Titanium oxynitride hard mask for lithographic patterning
- Patent number 8,987,133
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid hard mask for damascene and dual damascene
- Patent number 8,853,095
- Issue date Oct 7, 2014
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge protection of bonded wafers during wafer thinning
- Patent number 8,765,578
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superfilled metal contact vias for semiconductor devices
- Patent number 8,698,318
- Issue date Apr 15, 2014
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superfilled metal contact vias for semiconductor devices
- Patent number 8,691,687
- Issue date Apr 8, 2014
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned composite M-MOx/dielectric cap for Cu interconnect str...
- Patent number 8,299,365
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID COOLING OF SEMICONDUCTOR CHIPS UTILIZING SMALL SCALE STRUCT...
- Publication number 20160064307
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANGANESE OXIDE HARD MASK FOR ETCHING DIELECTRIC MATERIALS
- Publication number 20150348842
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS WITH SMALL SCALE STRUCTURES FOR LIQUID COOLING
- Publication number 20150348868
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20150262976
- Publication date Sep 17, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING BONDED WAFERS
- Publication number 20150221610
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Wei Lin
- B32 - LAYERED PRODUCTS
Information Patent Application
TITANIUM OXYNITRIDE HARD MASK FOR LITHOGRAPHIC PATTERNING
- Publication number 20150162239
- Publication date Jun 11, 2015
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANGANESE OXIDE HARD MASK FOR ETCHING DIELECTRIC MATERIALS
- Publication number 20140353839
- Publication date Dec 4, 2014
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTORTING DONOR WAFER TO CORRESPONDING DISTORTION OF HOST WAFER
- Publication number 20140356983
- Publication date Dec 4, 2014
- Wei Lin
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES
- Publication number 20140353828
- Publication date Dec 4, 2014
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLICAL PHYSICAL VAPOR DEPOSITION OF DIELECTRIC LAYERS
- Publication number 20140273425
- Publication date Sep 18, 2014
- CANON ANELVA CORPORATION
- Paul Jamison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-TO-WAFER FUSION BONDING CHUCK
- Publication number 20140265165
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-TO-WAFER OXIDE FUSION BONDING
- Publication number 20140261960
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC MATERIAL STACK INCLUDING A METAL-COMPOUND HARD MASK
- Publication number 20140199628
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Daniel C. Edelstein
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TITANIUM OXYNITRIDE HARD MASK FOR LITHOGRAPHIC PATTERNING
- Publication number 20140199832
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING FOR 3D DEVICE PACKAGING FABRICATION
- Publication number 20140113433
- Publication date Apr 24, 2014
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Protection of Bonded Wafers During Wafer Thinning
- Publication number 20130328174
- Publication date Dec 12, 2013
- International Business Machines Corporation
- Douglas C. La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION/ETCHING PROTECTION IN INTEGRATION CIRCUIT FABRICATIONS
- Publication number 20130320544
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERFILLED METAL CONTACT VIAS FOR SEMICONDUCTOR DEVICES
- Publication number 20130140681
- Publication date Jun 6, 2013
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STR...
- Publication number 20120175023
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BONDING INTERFACES ON CARBON-BASED MATERIALS FOR NANOELECT...
- Publication number 20110233513
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Christos D. Dimitrakopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERFILLED METAL CONTACT VIAS FOR SEMICONDUCTOR DEVICES
- Publication number 20110163449
- Publication date Jul 7, 2011
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STR...
- Publication number 20110162874
- Publication date Jul 7, 2011
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Substrate bonding with diffusion barrier structures

Semiconductor package with structures for cooling fluid retention

Method of forming an interconnect structure

Manganese oxide hard mask for etching dielectric materials

Wafer bonding for 3D device packaging fabrication

Liquid cooling of semiconductor chips utilizing small scale structures

Manganese oxide hard mask for etching dielectric materials

Titanium oxynitride hard mask for lithographic patterning

Substrate bonding with diffusion barrier structures

Distorting donor wafer to corresponding distortion of host wafer

Cyclical physical vapor deposition of dielectric layers

Corrosion/etching protection in integration circuit fabrications

Wafer-to-wafer oxide fusion bonding

Lithographic material stack including a metal-compound hard mask

Titanium oxynitride hard mask for lithographic patterning

Hybrid hard mask for damascene and dual damascene

Edge protection of bonded wafers during wafer thinning

Superfilled metal contact vias for semiconductor devices

Superfilled metal contact vias for semiconductor devices

Self-aligned composite M-MOx/dielectric cap for Cu interconnect str...

Patents Applicationslast 30 patents

LIQUID COOLING OF SEMICONDUCTOR CHIPS UTILIZING SMALL SCALE STRUCT...

MANGANESE OXIDE HARD MASK FOR ETCHING DIELECTRIC MATERIALS

SEMICONDUCTOR CHIPS WITH SMALL SCALE STRUCTURES FOR LIQUID COOLING

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

SEPARATING BONDED WAFERS

TITANIUM OXYNITRIDE HARD MASK FOR LITHOGRAPHIC PATTERNING

MANGANESE OXIDE HARD MASK FOR ETCHING DIELECTRIC MATERIALS

DISTORTING DONOR WAFER TO CORRESPONDING DISTORTION OF HOST WAFER

SUBSTRATE BONDING WITH DIFFUSION BARRIER STRUCTURES

CYCLICAL PHYSICAL VAPOR DEPOSITION OF DIELECTRIC LAYERS

WAFER-TO-WAFER FUSION BONDING CHUCK

WAFER-TO-WAFER OXIDE FUSION BONDING

LITHOGRAPHIC MATERIAL STACK INCLUDING A METAL-COMPOUND HARD MASK

TITANIUM OXYNITRIDE HARD MASK FOR LITHOGRAPHIC PATTERNING

WAFER BONDING FOR 3D DEVICE PACKAGING FABRICATION

Edge Protection of Bonded Wafers During Wafer Thinning

CORROSION/ETCHING PROTECTION IN INTEGRATION CIRCUIT FABRICATIONS

SUPERFILLED METAL CONTACT VIAS FOR SEMICONDUCTOR DEVICES

SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STR...

ENHANCED BONDING INTERFACES ON CARBON-BASED MATERIALS FOR NANOELECT...

SUPERFILLED METAL CONTACT VIAS FOR SEMICONDUCTOR DEVICES

SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STR...