Tugrul Yasar

Person

Woodstock, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ionized PVD with sequential deposition and etching
- Patent number 7,744,735
- Issue date Jun 29, 2010
- Tokyo Electron Limited
- Rodney Lee Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ionized PVD with sequential deposition and etching
- Patent number 6,755,945
- Issue date Jun 29, 2004
- Tokyo Electron Limited
- Tugrul Yasar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Redistribution of copper deposited films
- Patent number 6,730,605
- Issue date May 4, 2004
- Tokyo Electron Limited
- Chantal Arena-Foster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inductively-coupled plasma processing system
- Patent number 6,652,711
- Issue date Nov 25, 2003
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of passivating and stabilizing a Ti-PECVD process chamber an...
- Patent number 6,635,569
- Issue date Oct 21, 2003
- Tokyo Electron Limited
- Michael S. Ameen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for enhancing the adhesion of a barrier layer to a dielectric
- Patent number 6,632,737
- Issue date Oct 14, 2003
- Tokyo Electron Limited
- Joseph T. Hillman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for delivery of precursor vapor from low vapor...
- Patent number 6,548,112
- Issue date Apr 15, 2003
- Tokyo Electron Limited
- Joseph T. Hillman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Immersed inductively—coupled plasma source
- Patent number 6,417,626
- Issue date Jul 9, 2002
- Tokyo Electron Limited
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrically isolating an electrode in a P...
- Patent number 6,302,057
- Issue date Oct 16, 2001
- Tokyo Electron Limited
- Gerrit J. Leusink
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Transport system for wafer processing line
- Patent number 6,183,615
- Issue date Feb 6, 2001
- Tokyo Electron Limited
- Tugrul Yasar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process equipment with simultaneous or sequential deposition and et...
- Patent number 5,958,134
- Issue date Sep 28, 1999
- Tokyo Electron Limited
- Tugrul Yasar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduced stress sputtering target and method of manufacturing therefor
- Patent number 5,474,667
- Issue date Dec 12, 1995
- Materials Research Corporation
- Steven D. Hurwitt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self aligning in-situ ellipsometer and method of using for process...
- Patent number 5,408,322
- Issue date Apr 18, 1995
- Materials Research Corporation
- Jon S. Hsu
- G01 - MEASURING TESTING
Information Patent Grant
Process for airborne monolithic ferrite recording head with glass-p...
- Patent number 5,105,529
- Issue date Apr 21, 1992
- National Micronetics, Inc.
- Tugrul Yasar
- G11 - INFORMATION STORAGE
Information Patent Grant
Monolithic ferrite recording head with glass-protected, self-aligne...
- Patent number 5,072,322
- Issue date Dec 10, 1991
- National Micronetics, Inc.
- Tugrul Yasar
- G11 - INFORMATION STORAGE
Information Patent Grant
Beam lead arrangement for microelectronic devices
- Patent number 4,112,196
- Issue date Sep 5, 1978
- National Micronetics, Inc.
- Thomas R. Selig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ionized PVD with sequential deposition and etching
- Publication number 20040188239
- Publication date Sep 30, 2004
- Rodney Lee Robison
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized PVD with sequential deposition and etching
- Publication number 20030034244
- Publication date Feb 20, 2003
- Tugrul Yasar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Inductively-coupled plasma processing system
- Publication number 20020185229
- Publication date Dec 12, 2002
- Tokyo Electron Limited of TBS Broadcast Center
- Jozef Brcka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution of copper deposited films
- Publication number 20020148720
- Publication date Oct 17, 2002
- TOKYO ELECTRON LIMITED
- Chantal Arena-Foster
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing copper films having controlled morphology and...
- Publication number 20020137338
- Publication date Sep 26, 2002
- TOKYO ELECTRON LIMITED
- Tugrul Yasar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tugrul Yasar

Person

Patents Grantslast 30 patents

Ionized PVD with sequential deposition and etching

Ionized PVD with sequential deposition and etching

Redistribution of copper deposited films

Inductively-coupled plasma processing system

Method of passivating and stabilizing a Ti-PECVD process chamber an...

Method for enhancing the adhesion of a barrier layer to a dielectric

Apparatus and method for delivery of precursor vapor from low vapor...

Immersed inductively&#x02014;coupled plasma source

Apparatus and method for electrically isolating an electrode in a P...

Transport system for wafer processing line

Process equipment with simultaneous or sequential deposition and et...

Reduced stress sputtering target and method of manufacturing therefor

Self aligning in-situ ellipsometer and method of using for process...

Process for airborne monolithic ferrite recording head with glass-p...

Monolithic ferrite recording head with glass-protected, self-aligne...

Beam lead arrangement for microelectronic devices

Patents Applicationslast 30 patents

Ionized PVD with sequential deposition and etching

Ionized PVD with sequential deposition and etching

Inductively-coupled plasma processing system

Redistribution of copper deposited films

Method for depositing copper films having controlled morphology and...

Immersed inductively—coupled plasma source