Tuhin Sinha

Person

Hackensack, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optimized weight heat spreader for an electronic package
- Patent number 11,410,905
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via rivets in chip hotspots
- Patent number 11,308,257
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Dureseti Chidambarrao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mitigating thermal-mechanical strain and warpage of an organic lami...
- Patent number 11,239,183
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus having inter-chip stiffener
- Patent number 11,211,262
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Tuhin Sinha
- G11 - INFORMATION STORAGE
Information Patent Grant
Crack bifurcation in back-end-of-line
- Patent number 11,133,268
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi integrated circuit chip carrier package
- Patent number 10,978,314
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatially localized thermal interface materials
- Patent number 10,957,622
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Jonathan R. Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler particle position and density manipulation with applications...
- Patent number 10,903,184
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Viscoelastic pad upon integrated circuit device contact for multipa...
- Patent number 10,901,030
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Max S. Cioban
- G01 - MEASURING TESTING
Information Patent Grant
Heterogeneous thermal interface material for corner and or edge deg...
- Patent number 10,804,181
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for flip-chip package reliability monitoring u...
- Patent number 10,553,503
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Control warpage in a semiconductor chip package
- Patent number 10,541,211
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi integrated circuit chip carrier package
- Patent number 10,541,156
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test cell for laminate and method
- Patent number 10,381,276
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test cell for laminate and method
- Patent number 10,249,548
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scanning acoustic microscope sensor array for chip-packaging intera...
- Patent number 10,134,649
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for flip-chip package reliability monitoring u...
- Patent number 10,068,812
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Scanning acoustic microscope sensor array for chip-packaging intera...
- Patent number 10,008,427
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polygon die packaging
- Patent number 9,911,716
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for flip-chip package reliability monitoring u...
- Patent number 9,818,655
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FATIGUE FAILURE RESISTANT ELETRONIC PACKAGE
- Publication number 20220157685
- Publication date May 19, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE THICKNESS LID ADHESIVE
- Publication number 20210242098
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...
- Publication number 20210242139
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER
- Publication number 20210225665
- Publication date Jul 22, 2021
- International Business Machines Corporation
- TUHIN SINHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Lid Seal Band for Structural Stability in Multiple In...
- Publication number 20210111093
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK BIFURCATION IN BACK-END-OF-LINE
- Publication number 20200373250
- Publication date Nov 26, 2020
- International Business Machines Corporation
- TUHIN SINHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED WEIGHT HEAT SPREADER FOR AN ELECTRONIC PACKAGE
- Publication number 20200303279
- Publication date Sep 24, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIALLY LOCALIZED THERMAL INTERFACE MATERIALS
- Publication number 20200303282
- Publication date Sep 24, 2020
- International Business Machines Corporation
- Jonathan R. Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Thermal Interface Material for Corner and or Edge Deg...
- Publication number 20200294880
- Publication date Sep 17, 2020
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISCOELASTIC PAD UPON INTEGRATED CIRCUIT DEVICE CONTACT FOR MULTIPA...
- Publication number 20200264230
- Publication date Aug 20, 2020
- International Business Machines Corporation
- Max S. Cioban
- G01 - MEASURING TESTING
Information Patent Application
Multi Integrated Circuit Chip Carrier Package
- Publication number 20200135495
- Publication date Apr 30, 2020
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...
- Publication number 20200066669
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20180301355
- Publication date Oct 18, 2018
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20180076101
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...
- Publication number 20180047644
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...
- Publication number 20180019172
- Publication date Jan 18, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...
- Publication number 20170271219
- Publication date Sep 21, 2017
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...
- Publication number 20170194221
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20170178982
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...
- Publication number 20170162455
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
POLYGON DIE PACKAGING
- Publication number 20160225742
- Publication date Aug 4, 2016
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Tuhin Sinha

Person

Patents Grantslast 30 patents

Optimized weight heat spreader for an electronic package

Stacked via rivets in chip hotspots

Mitigating thermal-mechanical strain and warpage of an organic lami...

Electronic apparatus having inter-chip stiffener

Crack bifurcation in back-end-of-line

Multi integrated circuit chip carrier package

Spatially localized thermal interface materials

Filler particle position and density manipulation with applications...

Viscoelastic pad upon integrated circuit device contact for multipa...

Heterogeneous thermal interface material for corner and or edge deg...

Method and structure for flip-chip package reliability monitoring u...

Control warpage in a semiconductor chip package

Multi integrated circuit chip carrier package

Test cell for laminate and method

Test cell for laminate and method

Scanning acoustic microscope sensor array for chip-packaging intera...

Method and structure for flip-chip package reliability monitoring u...

Scanning acoustic microscope sensor array for chip-packaging intera...

Polygon die packaging

Method and structure for flip-chip package reliability monitoring u...

Patents Applicationslast 30 patents

FATIGUE FAILURE RESISTANT ELETRONIC PACKAGE

VARIABLE THICKNESS LID ADHESIVE

MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...

ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER

Heterogeneous Lid Seal Band for Structural Stability in Multiple In...

CRACK BIFURCATION IN BACK-END-OF-LINE

OPTIMIZED WEIGHT HEAT SPREADER FOR AN ELECTRONIC PACKAGE

SPATIALLY LOCALIZED THERMAL INTERFACE MATERIALS

Heterogeneous Thermal Interface Material for Corner and or Edge Deg...

VISCOELASTIC PAD UPON INTEGRATED CIRCUIT DEVICE CONTACT FOR MULTIPA...

Multi Integrated Circuit Chip Carrier Package

FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...

CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE

TEST CELL FOR LAMINATE AND METHOD

METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...

METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...

SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...

SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...

TEST CELL FOR LAMINATE AND METHOD

METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...

POLYGON DIE PACKAGING