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Kirchheim/Teck, DE
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Patent Grant
Thermal enhancement of exposed die-down package
Patent number
10,764,989
Issue date
Sep 1, 2020
Dialog Semiconductor (UK) Limited
Tung Ching Lui
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Re-Routable Clip for Leadframe Based Product
Publication number
20190259689
Publication date
Aug 22, 2019
Dialog Semiconductor (UK) Limited
Tung Ching Lui
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR