Tung-Heng Shie

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Spacer layer etch method providing enhanced microelectronic device...
- Patent number 7,678,655
- Issue date Mar 16, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung Der Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enhance the adhesion between dry film and seed metal
- Patent number 6,926,818
- Issue date Aug 9, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yih-Ann Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-on-chip (SOC) solutions with multiple devices by multiple po...
- Patent number 6,828,198
- Issue date Dec 7, 2004
- Taiwan Semiconductor Manufacturing Company
- Hung-Der Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a bump on a substrate without ribbon residue
- Patent number 6,696,356
- Issue date Feb 24, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Spacer layer etch method providing enhanced microelectronic device...
- Publication number 20080026518
- Publication date Jan 31, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung Der Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-on-chip (SOC) solutions with multiple devices by multiple po...
- Publication number 20040185623
- Publication date Sep 23, 2004
- Taiwan Semiconductor Manaufacturing Co.
- Hung-Der Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a bump on a substrate without ribbon residue
- Publication number 20030124832
- Publication date Jul 3, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS