Tung-Liang Shao

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Taoyuan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level packaging
- Patent number 6,387,795
- Issue date May 14, 2002
- Apack Technologies Inc.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming bumps
- Publication number 20020137325
- Publication date Sep 26, 2002
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS