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Hong Kong, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Etch isolation LPCC/QFN strip
Patent number
9,806,006
Issue date
Oct 31, 2017
UTAC HEADQUARTERS PTD. LTD.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing leadless integrated circuit packages having...
Patent number
9,337,095
Issue date
May 10, 2016
Kaixin, Inc.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-bonded substrate for integrated circuit package and method of m...
Patent number
8,569,110
Issue date
Oct 29, 2013
QPL Limited
John Robert McMillan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Pre-bonded substrate for integrated circuit package and method of m...
Patent number
8,513,786
Issue date
Aug 20, 2013
QPL Limited
John Robert McMillan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of manufacturing leadless integrated circuit packages having...
Patent number
8,497,159
Issue date
Jul 30, 2013
Kaixin, Inc.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate for integrated circuit package with selective exposure of...
Patent number
8,338,924
Issue date
Dec 25, 2012
QPL Limited
John Robert McMillan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless integrated circuit package having electrically routed cont...
Patent number
8,072,053
Issue date
Dec 6, 2011
Kaixin Inc.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING LEADLESS INTEGRATED CIRCUIT PACKAGES HAVING...
Publication number
20130288432
Publication date
Oct 31, 2013
Kaixin, Inc.
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF M...
Publication number
20120146200
Publication date
Jun 14, 2012
John Robert MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE WITH SELECTIVE EXPOSURE OF...
Publication number
20120146199
Publication date
Jun 14, 2012
QPL LIMITED
John Robert MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF M...
Publication number
20120149154
Publication date
Jun 14, 2012
John Robert MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing Leadless Integrated Circuit Packages Having...
Publication number
20120045870
Publication date
Feb 23, 2012
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCH ISOLATION LPCC/QFN STRIP
Publication number
20110284495
Publication date
Nov 24, 2011
ASAT LIMITED
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF
Publication number
20100314728
Publication date
Dec 16, 2010
Tung Lok Li
H01 - BASIC ELECTRIC ELEMENTS