Tung Lun Loo

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Sungai Petani, MY

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Patents Grantslast 30 patents

Information Patent Grant
Conformable heat sink pedestal for multi-chip packages
- Patent number 11,521,911
- Issue date Dec 6, 2022
- Intel Corporation
- Eng Kwong Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONFORMABLE HEAT SINK PEDESTAL FOR MULTI-CHIP PACKAGES
- Publication number 20220068755
- Publication date Mar 3, 2022
- Intel Corporation
- Eng Kwong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABANDONED OBJECT DETECTION
- Publication number 20220012490
- Publication date Jan 13, 2022
- Charmaine Rui Qin Chan
- G06 - COMPUTING CALCULATING COUNTING