Tung-Lung Lai

Person

Hsin-chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor structure
- Patent number 8,980,703
- Issue date Mar 17, 2015
- Maxchip Electronics Corp.
- Chen-Chiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 8,907,395
- Issue date Dec 9, 2014
- Maxchip Electronics Corp.
- Chen-Chiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure
- Patent number 8,895,386
- Issue date Nov 25, 2014
- Maxchip Electronics Corp.
- Chen-Chiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electronic mechanical system structure
- Patent number 8,502,328
- Issue date Aug 6, 2013
- Maxchip Electronics Corp.
- Tsai-Chiang Nieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of micro electronic mechanical system structure
- Patent number 8,163,583
- Issue date Apr 24, 2012
- Maxchip Electronics Corp.
- Tsai-Chiang Nieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barrier layer stack to prevent Ti diffusion
- Patent number 7,470,992
- Issue date Dec 30, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing one-time electrically programmable read on...
- Patent number 7,074,674
- Issue date Jul 11, 2006
- Powerchip Semiconductor Corp.
- Ko-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer stack to prevent Ti diffusion
- Patent number 7,064,056
- Issue date Jun 20, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool for installing seal ring
- Patent number 6,526,640
- Issue date Mar 4, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Je Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20150024562
- Publication date Jan 22, 2015
- MAXCHIP ELECTRONICS CORP.
- Chen-Chiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20140024183
- Publication date Jan 23, 2014
- Chen-Chiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20130043522
- Publication date Feb 21, 2013
- MAXCHIP ELECTRONICS CORP.
- Chen-Chiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE
- Publication number 20120153469
- Publication date Jun 21, 2012
- MAXCHIP ELECTRONICS CORP.
- Tsai-Chiang Nieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ONE TIME PROGRAMMABLE MEMORY AND THE MANUFACTURING METHOD AND OPERA...
- Publication number 20120008364
- Publication date Jan 12, 2012
- MAXCHIP ELECTRONICS CORP.
- Tung-Ming Lai
- G11 - INFORMATION STORAGE
Information Patent Application
MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE AND MANUFACTURING METH...
- Publication number 20110169106
- Publication date Jul 14, 2011
- MAXCHIP ELECTRONICS CORP.
- Tsai-Chiang Nieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BARRIER LAYER STACK TO PREVENT TI DIFFUSION
- Publication number 20060261478
- Publication date Nov 23, 2006
- Taiwan Semiconductor Manufacturing Co., LTD
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ONE-TIME ELECTRICALLY PROGRAMMABLE READ ON...
- Publication number 20060154418
- Publication date Jul 13, 2006
- Ko-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier layer stack to prevent Ti diffusion
- Publication number 20040253807
- Publication date Dec 16, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS

Tung-Lung Lai

Person

Patents Grantslast 30 patents

Method of forming semiconductor structure

Semiconductor structure

Method of forming semiconductor structure

Micro electronic mechanical system structure

Manufacturing method of micro electronic mechanical system structure

Barrier layer stack to prevent Ti diffusion

Method for manufacturing one-time electrically programmable read on...

Barrier layer stack to prevent Ti diffusion

Tool for installing seal ring

Patents Applicationslast 30 patents

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE

ONE TIME PROGRAMMABLE MEMORY AND THE MANUFACTURING METHOD AND OPERA...

MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE AND MANUFACTURING METH...

BARRIER LAYER STACK TO PREVENT TI DIFFUSION

METHOD FOR MANUFACTURING ONE-TIME ELECTRICALLY PROGRAMMABLE READ ON...

Barrier layer stack to prevent Ti diffusion