Tung-Shen Wu

Follow

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Preparation method of underfill for flip chip package and the device
- Patent number 6,608,391
- Issue date Aug 19, 2003
- Orient Semiconductor Electronics Limited
- Tung-Shen Wu
- H01 - BASIC ELECTRIC ELEMENTS