Tung-Ti YEH

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with multi-level arrangement of e-fuse protected...
- Patent number 10,014,252
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with polymeric layer and manufactur...
- Patent number 9,711,474
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Gia-Her Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming stacked capacitors with fuse protection
- Patent number 9,385,079
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft material wafer bonding and method of bonding
- Patent number 8,748,885
- Issue date Jun 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and method of processing wafer
- Patent number 8,592,297
- Issue date Nov 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite film for phase change memory devices
- Patent number 8,344,343
- Issue date Jan 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR WITH FUSE PROTECTION
- Publication number 20160315050
- Publication date Oct 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160086902
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- GIA-HER LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor with Fuse Protection
- Publication number 20150214150
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING
- Publication number 20130207098
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD OF PROCESSING WAFER
- Publication number 20130154060
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE FILM FOR PHASE CHANGE MEMORY DEVICES
- Publication number 20100252794
- Publication date Oct 7, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treated Chalcogenide Layer for Semiconductor Devices
- Publication number 20100213431
- Publication date Aug 26, 2010
- Tung-Ti Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for removing tungsten particles after tungsten etch-back
- Publication number 20050112903
- Publication date May 26, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Tung-Ti YEH

Person

Patents Grantslast 30 patents

Integrated circuit with multi-level arrangement of e-fuse protected...

Semiconductor package structure with polymeric layer and manufactur...

Methods for forming stacked capacitors with fuse protection

Soft material wafer bonding and method of bonding

Wafer and method of processing wafer

Composite film for phase change memory devices

Patents Applicationslast 30 patents

CAPACITOR WITH FUSE PROTECTION

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Capacitor with Fuse Protection

SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING

WAFER AND METHOD OF PROCESSING WAFER

COMPOSITE FILM FOR PHASE CHANGE MEMORY DEVICES

Treated Chalcogenide Layer for Semiconductor Devices

Process for removing tungsten particles after tungsten etch-back