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Tutomu Ohshima
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Tokyo, JP
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last 30 patents
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Patent Grant
Method of manufacturing a multilayered printed wiring board
Patent number
5,526,564
Issue date
Jun 18, 1996
NEC Corporation
Tutomu Ohshima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayered printed wiring board and method of manufacturing the same
Patent number
5,455,393
Issue date
Oct 3, 1995
NEC Corporation
Tutomu Ohshima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR