Twan Sing Loo

Person

Butterworth, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Co-planar interconnection mechanisms for circuit boards
- Patent number 12,349,276
- Issue date Jul 1, 2025
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vapor chamber with ionized fluid
- Patent number 12,336,145
- Issue date Jun 17, 2025
- Intel Corporation
- Twan Sing Loo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Radiation shield and groove in support structure
- Patent number 12,309,984
- Issue date May 20, 2025
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic devices with moveable display screens
- Patent number 12,204,370
- Issue date Jan 21, 2025
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DEPLOYABLE FEET AND HINGE GASKETS FOR ELECTRONIC DEVICES
- Publication number 20240385654
- Publication date Nov 21, 2024
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
- Publication number 20230395480
- Publication date Dec 7, 2023
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...
- Publication number 20230397323
- Publication date Dec 7, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METH...
- Publication number 20230337406
- Publication date Oct 19, 2023
- Intel Corporation
- Ritu BAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS TO INCREASE RIGIDITY OF PRINTED CIRCUIT BOARDS
- Publication number 20230108868
- Publication date Apr 6, 2023
- Intel Corporation
- Jia Yan Go
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN ON PRINTED CIRCUIT BOARD
- Publication number 20220225530
- Publication date Jul 14, 2022
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS
- Publication number 20220174820
- Publication date Jun 2, 2022
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VAPOR CHAMBER WITH IONIZED FLUID
- Publication number 20220095484
- Publication date Mar 24, 2022
- Intel Corporation
- Twan Sing Loo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RADIATION SHIELD AND GROOVE IN SUPPORT STRUCTURE
- Publication number 20210410341
- Publication date Dec 30, 2021
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES WITH MOVEABLE DISPLAY SCREENS
- Publication number 20210397219
- Publication date Dec 23, 2021
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FAN MODULE INTERCONNECT APPARATUS FOR ELECTRONIC DEVICES
- Publication number 20210120699
- Publication date Apr 22, 2021
- Intel Corporation
- Chee How Lim
- G06 - COMPUTING CALCULATING COUNTING

Twan Sing Loo

Person

Patents Grantslast 30 patents

Co-planar interconnection mechanisms for circuit boards

Vapor chamber with ionized fluid

Radiation shield and groove in support structure

Cooling systems, cooling structures and electronic devices and meth...

Electronic devices with moveable display screens

Patents Applicationslast 30 patents

DEPLOYABLE FEET AND HINGE GASKETS FOR ELECTRONIC DEVICES

SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS

PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...

COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METH...

METHODS AND APPARATUS TO INCREASE RIGIDITY OF PRINTED CIRCUIT BOARDS

FAN ON PRINTED CIRCUIT BOARD

CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS

VAPOR CHAMBER WITH IONIZED FLUID

RADIATION SHIELD AND GROOVE IN SUPPORT STRUCTURE

ELECTRONIC DEVICES WITH MOVEABLE DISPLAY SCREENS

FAN MODULE INTERCONNECT APPARATUS FOR ELECTRONIC DEVICES