Twila J. Eichman

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San Marcos, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate dielectric crack prevention using interleaved metal plane
- Patent number 10,537,019
- Issue date Jan 14, 2020
- NXP USA, INC.
- Tingdong Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with multilayer flex interconnect structures
- Patent number 9,111,937
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH MULTILAYER FLEX INTERCONNECT STRUCTURES
- Publication number 20140353830
- Publication date Dec 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS