Tyler N. Osborn

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ablation method and recipe for wafer level underfill material patte...
- Patent number 9,786,517
- Issue date Oct 10, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 9,312,237
- Issue date Apr 12, 2016
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die assembly on thin dielectric sheet
- Patent number 9,177,831
- Issue date Nov 3, 2015
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution to deal with die warpage during 3D die-to-die stacking
- Patent number 8,970,051
- Issue date Mar 3, 2015
- Intel Corporation
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 8,952,532
- Issue date Feb 10, 2015
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TSV-CONNECTED BACKSIDE DECOUPLING
- Publication number 20170012029
- Publication date Jan 12, 2017
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ASSEMBLY ON THIN DIELECTRIC SHEET
- Publication number 20160043056
- Publication date Feb 11, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20150163904
- Publication date Jun 11, 2015
- Intel Corporation
- Omkar G. Karhade
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...
- Publication number 20150108204
- Publication date Apr 23, 2015
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ASSEMBLY ON THIN DIELECTRIC SHEET
- Publication number 20150091182
- Publication date Apr 2, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
- Publication number 20150072479
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLUTION TO DEAL WITH DIE WARPAGE DURING 3D DIE-TO-DIE STACKING
- Publication number 20150001740
- Publication date Jan 1, 2015
- Hualiang SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...
- Publication number 20140332956
- Publication date Nov 13, 2014
- Tieyu ZHENG
- H01 - BASIC ELECTRIC ELEMENTS

Tyler N. Osborn

Person

Patents Grantslast 30 patents

High density interconnection of microelectronic devices

Ablation method and recipe for wafer level underfill material patte...

High density interconnection of microelectronic devices

Integrated circuit package with spatially varied solder resist open...

Die assembly on thin dielectric sheet

Solution to deal with die warpage during 3D die-to-die stacking

Integrated circuit package with spatially varied solder resist open...

Patents Applicationslast 30 patents

TSV-CONNECTED BACKSIDE DECOUPLING

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

DIE ASSEMBLY ON THIN DIELECTRIC SHEET

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...

DIE ASSEMBLY ON THIN DIELECTRIC SHEET

ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...

SOLUTION TO DEAL WITH DIE WARPAGE DURING 3D DIE-TO-DIE STACKING

INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...