Tyler Parent

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a die and through-substrate via
- Patent number 9,659,900
- Issue date May 23, 2017
- Maxim Intergrated Products, Inc.
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through-substrate via
- Patent number 9,224,714
- Issue date Dec 29, 2015
- Maxim Integrated Products, Inc.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a die and through substrate-via
- Patent number 9,196,587
- Issue date Nov 24, 2015
- Maxim Integrated Products, Inc.
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through-substrate via
- Patent number 9,105,750
- Issue date Aug 11, 2015
- Maxim Integrated Products, Inc.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through-substrate via
- Patent number 8,748,232
- Issue date Jun 10, 2014
- Maxim Integrated Products, Inc.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through-substrate via
- Patent number 8,742,574
- Issue date Jun 3, 2014
- Maxim Integrated Products, Inc.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH-SUBSTRATE VIA
- Publication number 20160079197
- Publication date Mar 17, 2016
- Maxim Integrated Products, Inc.
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA
- Publication number 20140284793
- Publication date Sep 25, 2014
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH SUBSTRATE-VIA
- Publication number 20140264844
- Publication date Sep 18, 2014
- Xuejun Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA
- Publication number 20130168850
- Publication date Jul 4, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA
- Publication number 20130037948
- Publication date Feb 14, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS