Tyrone HUANG

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MARKHAM, CA

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Patents Grantslast 30 patents

Information Patent Grant
Sharing package pins in a multi-chip module (MCM)
- Patent number 12,174,771
- Issue date Dec 24, 2024
- Advanced Micro Device, Inc.
- Yulei Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-silicon via layout for multi-die integrated circuits
- Patent number 12,107,076
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Wonjun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sharing package pins in a multi-chip module (MCM)
- Patent number 11,886,370
- Issue date Jan 30, 2024
- Advanced Micro Devices, Inc.
- Yulei Shen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
- Publication number 20240126712
- Publication date Apr 18, 2024
- ADVANCED MICRO DEVICES, INC.
- YULEI SHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
- Publication number 20230367730
- Publication date Nov 16, 2023
- ADVANCED MICRO DEVICES, INC.
- YULEI SHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS
- Publication number 20230207527
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- Wonjun JUNG
- H01 - BASIC ELECTRIC ELEMENTS