Tz-Cheng Chiu

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Raised solder-mask-defined (SMD) solder ball pads for a laminate el...
- Patent number 7,679,190
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Patent number 7,572,677
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased stand-off height integrated circuit assemblies, systems,...
- Patent number 7,393,719
- Issue date Jul 1, 2008
- Texas Instruments Incorporated
- Charles Anthony Odegard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing system and apparatus for balanced product flow with a...
- Patent number 7,323,362
- Issue date Jan 29, 2008
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised solder-mask-defined (SMD) solder ball pads for a laminate el...
- Patent number 7,294,451
- Issue date Nov 13, 2007
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joints for copper metallization having reduced interfacial v...
- Patent number 7,267,861
- Issue date Sep 11, 2007
- Texas Instruments Incorporated
- Darvin R. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Patent number 7,126,217
- Issue date Oct 24, 2006
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing system and apparatus for balanced product flow with a...
- Patent number 6,977,429
- Issue date Dec 20, 2005
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for improving thermal stability of copper damascene structure
- Patent number 6,903,000
- Issue date Jun 7, 2005
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite lid for land grid array (LGA) flip-chip package assembly
- Patent number 6,861,292
- Issue date Mar 1, 2005
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite lid for land grid array (LGA) flip-chip package assembly
- Patent number 6,784,535
- Issue date Aug 31, 2004
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip device strengthened by substrate metal ring
- Patent number 6,734,567
- Issue date May 11, 2004
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer-embedded solder bumps for reliable plastic package attachment
- Patent number 6,696,644
- Issue date Feb 24, 2004
- Texas Instruments Incorporated
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Increased Stand-Off Height Integrated Circuit Assemblies, Systems,...
- Publication number 20080218986
- Publication date Sep 11, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate El...
- Publication number 20080023834
- Publication date Jan 31, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement in Semiconductor Packages for Inhibiting Adhesion of Li...
- Publication number 20070004083
- Publication date Jan 4, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder joints for copper metallization having reduced interfacial v...
- Publication number 20060267157
- Publication date Nov 30, 2006
- Darvin R. Edwards
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method for polymer encapsulated solder lid attach
- Publication number 20060270106
- Publication date Nov 30, 2006
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increased stand-off height integrated circuit assemblies, systems,...
- Publication number 20060234490
- Publication date Oct 19, 2006
- Charles Anthony Odegard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Board level solder joint support for BGA packages under heatsink co...
- Publication number 20060043586
- Publication date Mar 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Arrangement in semiconductor packages for inhibiting adhesion of li...
- Publication number 20060027921
- Publication date Feb 9, 2006
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing system and apparatus for balanced product flow with a...
- Publication number 20060027907
- Publication date Feb 9, 2006
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-doped reflow interconnections for copper pads
- Publication number 20050275096
- Publication date Dec 15, 2005
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for improving thermal stability of copper damascene structure
- Publication number 20050186788
- Publication date Aug 25, 2005
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire loop grid array package
- Publication number 20050133928
- Publication date Jun 23, 2005
- Gregory E. Howard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacturing system and apparatus for balanced product flow with a...
- Publication number 20050124090
- Publication date Jun 9, 2005
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised solder-mask-defined (SMD) solder ball pads for a laminate el...
- Publication number 20050106505
- Publication date May 19, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LID FOR LAND GRID ARRAY (LGA) FLIP-CHIP PACKAGE ASSEMBLY
- Publication number 20050026331
- Publication date Feb 3, 2005
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer-embedded solder bumps for reliable plastic package attachment
- Publication number 20040149479
- Publication date Aug 5, 2004
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-chip device strengthened by substrate metal ring
- Publication number 20040036179
- Publication date Feb 26, 2004
- Tz-Cheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER-EMBEDDED SOLDER BUMPS FOR RELIABLE PLASTIC PACKAGE ATTACHMENT
- Publication number 20040027788
- Publication date Feb 12, 2004
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System for improving thermal stability of copper damascene structure
- Publication number 20030124828
- Publication date Jul 3, 2003
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS

Tz-Cheng Chiu

Person

Patents Grantslast 30 patents

Raised solder-mask-defined (SMD) solder ball pads for a laminate el...

Arrangement in semiconductor packages for inhibiting adhesion of li...

Increased stand-off height integrated circuit assemblies, systems,...

Manufacturing system and apparatus for balanced product flow with a...

Raised solder-mask-defined (SMD) solder ball pads for a laminate el...

Solder joints for copper metallization having reduced interfacial v...

Arrangement in semiconductor packages for inhibiting adhesion of li...

Manufacturing system and apparatus for balanced product flow with a...

System for improving thermal stability of copper damascene structure

Composite lid for land grid array (LGA) flip-chip package assembly

Composite lid for land grid array (LGA) flip-chip package assembly

Flip-chip device strengthened by substrate metal ring

Polymer-embedded solder bumps for reliable plastic package attachment

Patents Applicationslast 30 patents

Increased Stand-Off Height Integrated Circuit Assemblies, Systems,...

Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate El...

Arrangement in Semiconductor Packages for Inhibiting Adhesion of Li...

Solder joints for copper metallization having reduced interfacial v...

System and method for polymer encapsulated solder lid attach

Increased stand-off height integrated circuit assemblies, systems,...

Board level solder joint support for BGA packages under heatsink co...

Arrangement in semiconductor packages for inhibiting adhesion of li...

Manufacturing system and apparatus for balanced product flow with a...

Pre-doped reflow interconnections for copper pads

System for improving thermal stability of copper damascene structure

Wire loop grid array package

Manufacturing system and apparatus for balanced product flow with a...

Raised solder-mask-defined (SMD) solder ball pads for a laminate el...

COMPOSITE LID FOR LAND GRID ARRAY (LGA) FLIP-CHIP PACKAGE ASSEMBLY

Polymer-embedded solder bumps for reliable plastic package attachment

Flip-chip device strengthened by substrate metal ring

POLYMER-EMBEDDED SOLDER BUMPS FOR RELIABLE PLASTIC PACKAGE ATTACHMENT

System for improving thermal stability of copper damascene structure