Tz-Cheng Chiu

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Packaging method involving rearrangement of dice
- Patent number 8,431,437
- Issue date Apr 30, 2013
- ChipMOS Technologies Inc.
- Yu-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method involving rearrangement of dice
- Patent number 8,426,245
- Issue date Apr 23, 2013
- ChipMOS Technologies Inc.
- Yu-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE
- Publication number 20110183466
- Publication date Jul 28, 2011
- Yu-Ren CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE
- Publication number 20090047754
- Publication date Feb 19, 2009
- CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
- Yu-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS