Tze Wei Dennis Chew

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive bonding technique for use with capacitive micro-sensors
- Patent number 9,082,681
- Issue date Jul 14, 2015
- STMicroelectronics Pte Ltd
- Olivier Le Neel
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE BONDING TECHNIQUE FOR USE WITH CAPACITIVE MICRO-SENSORS
- Publication number 20140291829
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Olivier Le Neel
- B81 - MICRO-STRUCTURAL TECHNOLOGY