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Tzi-Yi Shieh

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  • Hsin-Chu, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CMP SAFE ALIGNMENT MARK
    • Publication number 20240387398
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Huang-Jen HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
    • Publication number 20240203750
    • Publication date Jun 20, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Chen WEI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHEMICAL MECHANICAL PLANARIZATION MEMBRANE
    • Publication number 20220184773
    • Publication date Jun 16, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Ping Chen
    • B24 - GRINDING POLISHING
  • Information Patent Application

    CMP SAFE ALIGNMENT MARK
    • Publication number 20220102285
    • Publication date Mar 31, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Huang-Jen HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
    • Publication number 20210407819
    • Publication date Dec 30, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Chen Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHEMICAL MECHANICAL PLANARIZATION MEMBRANE
    • Publication number 20190091829
    • Publication date Mar 28, 2019
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Cheng-Ping Chen
    • B24 - GRINDING POLISHING
  • Information Patent Application

    TOOL AND METHOD OF REFLOW
    • Publication number 20180050425
    • Publication date Feb 22, 2018
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shih-Yen Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Tool And Method Of Reflow
    • Publication number 20150201502
    • Publication date Jul 16, 2015
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shih-Yen Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TWO STEP MOLDING GRINDING FOR PACKAGING APPLICATIONS
    • Publication number 20150187607
    • Publication date Jul 2, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Wen-Chun Huang
    • H01 - BASIC ELECTRIC ELEMENTS